MEMS Manufacturing Solutions
Micro-electromechanical systems (MEMS) technologies are increasingly being used in consumer products, such as ink jet printer heads, inertial sensors, and mobile and communications applications. They are also being developed for evolving technologies such as the application of augmented reality (AR) for enhanced gaming experiences.
The growth in these consumer market applications is driving the need for high-volume manufacturing of MEMS devices. This requires the high levels of cost-efficient manufacturing typically seen in commodity semiconductor devices, where process repeatability is critical for device yield and system productivity.The technologies behind Lam’s silicon etch, dielectric deposition, spin wet clean, and dry strip products are ideally suited for the production of MEMS devices, as well as power devices and through-silicon vias (TSVs). Using Lam’s proven capabilities for these process areas, manufacturers are able to ramp quickly and cost-effectively to high-volume production.
|Deep Silicon Etch System
Based on Lam’s industry-leading silicon etch systems, the TCP® 9400DSiE™ product family is being utilized by major customers worldwide for a wide range of MEMS, TSV, power device, and passive component deep silicon etch applications. The products have the flexibility to use both Bosch and steady-state processes to meet the challenges of silicon deep reactive ion etch. Pulsed low-frequency plasma technology enables stop-on-oxide etch with minimal notching. System features such as in situ automated chamber cleaning and precise control of RF delivery provide superior process stability for high yield on demanding device requirements.
Lam’s proven plasma-enhanced chemical vapor deposition (PECVD) products are capable of depositing low-temperature passivation, hardmask, and packaging dielectric films with low defectivity, excellent uniformity and hermetic film properties, and high productivity. MEMS application-specific films include SiO2, SiN, SiON, UVSiN, and TEOS.
|Spin Wet Clean
Employing Lam’s spin technology, our production-proven wet clean/wet etch products address a broad set of process applications. These include silicon substrate wet etching with excellent uniformity, backside/bevel film removal with controlled undercut, metal structuring with defined profiles, and wet photoresist strip with critical chemical handling capability. Single-, dual-, and multi-chamber tool configurations are available.
Lam’s dry strip systems provide high throughput for a wide range of photoresist strip and clean, descum, and light etch solutions. Dual source technology – downstream microwave or RF bias – provides lower chemical costs compared to wet clean approaches. Substrates from 2 to 8 inches in diameter are supported.
|For more information about our cost-effective process solutions for MEMS manufacturing, please contact us at email@example.com.|