ETCH PRODUCTS

Carving Features with Atomic Precision

Lam Research plasma etch – conductor etch

Kiyo® Product Family

Technology: Reactive Ion Etch, Atomic Layer Etch (ALE)
Solutions: Transistor, Interconnect, Patterning, Advanced Memory

Conductor etch helps shape the electrically “active” materials used in the parts of a semiconductor device. Even a slight variation in these miniature structures can create an electrical defect that impacts device performance. In fact, these structures are so tiny that etch processes are pushing the boundaries of the basic laws of physics and chemistry.

Lam’s Kiyo product family delivers the high-performance capabilities needed to precisely and consistently form these conductive features with high productivity.

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Lam Research plasma etch – metal etch

Versys® Metal Product Family

Technology: Reactive Ion Etch
Solutions: Interconnect

Metal etch processes play a key role in connecting the individual components that form an integrated circuit (IC), such as forming wires and electrical connections. These processes are also used to drill through the metal hardmasks (MHM) that are used to pattern features too small for conventional masks, thereby allowing continued shrinking of feature dimensions.

To enable performing these critical etch steps, Lam’s Versys Metal product family provides high-productivity capability on a flexible platform.

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Lam Research plasma etch – dielectric etch

Flex™ Product Family

Technology: Reactive Ion Etch, Atomic Layer Etch (ALE)
Solutions: Transistor, Interconnect, Patterning, Advanced Memory

Dielectric etch carves patterns in insulating materials to create barriers between the electrically conductive parts of a semiconductor device. For advanced devices, these structures can be extremely tall and thin and involve complex, sensitive materials. Slight deviations from the target feature profile – even at the atomic level – can negatively affect electrical properties of the device.

To precisely create these challenging structures, Lam’s Flex product family offers differentiated technologies and application-focused capabilities for critical dielectric etch applications.

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Lam Research plasma etch – through-silicon via (TSV) etch

Syndion® Product Family

Technology: Reactive Ion Etch
Solutions: Packaging

Through-silicon vias (TSVs) provide interconnect capability for die-to-die stacking for 3D integrated circuits (3D ICs), which in turn enable producing smaller, faster, and more powerful mobile electronics. To form these tall “columns” (or vias), multiple carefully controlled etch steps must tunnel with precision through a variety of films.

Lam’s Syndion etch product family provides the layer-by-layer process flexibility and control needed, delivering cost-efficient via etch for TSV applications.

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