PRODUCTS FOR MEMS & LED

Providing Process Solutions to Create Miniature Magic

Micro-electromechanical systems (MEMS) technologies are increasingly being used in consumer products, such as ink jet printer heads, inertial sensors, and mobile and communications applications. They are also being developed for evolving technologies such as the application of augmented reality (AR) for enhanced gaming experiences.

The growth in these consumer market applications is driving the need for high-volume manufacturing of MEMS devices. This requires the high levels of cost-efficient manufacturing typically seen in commodity semiconductor devices, where process repeatability is critical for device yield and system productivity.

The technologies behind Lam’s silicon etch, dielectric deposition, spin wet clean, and dry strip products are ideally suited for the production of MEMS devices, as well as power devices and through-silicon vias (TSVs). Using Lam’s proven capabilities for these process areas, manufacturers are able to ramp quickly and cost-effectively to high-volume production.

Deep Silicon Etch

Lam Research plasma etch for MEMS – deep silicon etch

Based on Lam’s industry-leading silicon etch systems, the TCP® 9400DSiE™ product family is being utilized by major customers worldwide for a wide range of MEMS, TSV, power device, and passive component deep silicon etch applications. The products have the flexibility to use both Bosch and steady-state processes to meet the challenges of silicon deep reactive ion etch. Pulsed low-frequency plasma technology enables stop-on-oxide etch with minimal notching. System features such as in-situ automated chamber cleaning and precise control of RF delivery provide superior process stability for high yield on demanding device requirements.

PECVD

Lam Research dielectric films for MEMS – plasma-enhanced chemical vapor deposition (PECVD)

Lam’s proven plasma-enhanced chemical vapor deposition (PECVD) products are capable of depositing low-temperature passivation, hardmask, and packaging dielectric films with low defectivity, excellent uniformity and hermetic film properties, and high productivity. MEMS application-specific films include SiO2, SiN, SiON, UVSiN, and TEOS.

Spin Wet Clean

Lam Research wet clean for MEMS

Employing Lam’s spin technology, our production-proven wet clean/wet etch products address a broad set of process applications. These include silicon substrate wet etching with excellent uniformity, backside/bevel film removal with controlled undercut, metal structuring with defined profiles, and wet photoresist strip with critical chemical handling capability. Single-, dual-, and multi-chamber tool configurations are available.

Dry Strip/Descum

Lam Research photoresist strip for MEMS

Lam’s dry strip systems provide high throughput for a wide range of photoresist strip and clean, descum, and light etch solutions. Dual-source technology – downstream microwave or RF bias – provides lower chemical costs compared to wet clean approaches. Substrates from 2 to 8 inches in diameter are supported.

For more information about our cost-effective process solutions for MEMS manufacturing, please contact us at salesinformation@lamresearch.com.

Light-emitting diodes (LEDs) are increasingly found in everyday products, from mobile phones and handheld media devices to televisions and car displays. Demand for high-performance LEDs – bright, accurate in color, and energy efficient – continues to grow as new consumer applications emerge.

With growing consumer applications, LED manufacturers require production-worthy, high-productivity equipment that delivers repeatable process results for high device yield.

Lam Research has over 25 years of experience with plasma etch, thin film dielectrics, metallization, and photoresist strip technologies that can be applied to the LED manufacturing market. We have leveraged our proven technologies to develop a wide range of LED-specific process solutions for front-end chip manufacturing and back-end packaging that address the challenges of cost-efficient, high-volume production.

Plasma Etch

Lam Research plasma etch for LED

Our industry-leading plasma etch systems deliver excellent uniformity and productivity at a low cost of ownership. Systems are used in high-volume production for a diverse set of processes and support both 6- and 8-inch diameter capability on the same chamber. LED applications include patterned sapphire substrate (PSS); oxide mask open; and Al, GaN, and W etch.

PECVD

Lam Research dielectric films for LED – plasma-enhanced chemical vapor deposition (PECVD)

Lam’s proven plasma-enhanced chemical vapor deposition (PECVD) products are capable of depositing low-temperature passivation, hardmask, and packaging films with low-defectivity, excellent uniformity and hermetic film properties, and high productivity. LED application-specific films include SiO2, SiN, SiON, UVSiN, and TEOS.

Electroplating

Lam Research metal films for LED – electroplating

Our production-proven systems deliver copper-plated thicknesses of 50 μm and higher with high throughput. For LED applications, chemistries include Cu, Ni, and Au. Modular system architecture allows for configuration flexibility that is expandable to 16 cells. Trays/carriers of 4 to 12 inches in diameter are supported.

Dry Strip/Descum

Lam Research photoresist strip for LED

Lam’s dry strip systems provide high throughput for a wide range of photoresist strip and clean, descum, and light etch solutions. Dual source technology – downstream microwave or RF bias – provides lower chemical costs compared to wet clean approaches. Substrates from 2 to 8 inches in diameter are supported.

For more information about our cost-effective process solutions for LED manufacturing, please contact us at salesinformation@lamresearch.com.

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