Spin Clean Series — Single-Wafer Wet Clean

Wafer cleaning is a highly complex market that encompasses steps throughout the entire manufacturing process – front-end-of-line (FEOL), back-end-of-line (BEOL), and advanced packaging. The number of cleaning steps continues to grow at an aggressive rate, each step with different selectivity and defectivity requirements. With the need to clean fragile features without causing damage, chipmakers are turning to single-wafer wet clean processing technology for next-generation device manufacturing. With the acquisition of the SEZ Group in March 2008, Lam Research has expanded its product offering to include spin technology-based wet clean systems. Proprietary spin process single-wafer technology forms the basis of a broad product offering for FEOL, BEOL, and advanced packaging wafer cleaning and decontamination applications:

• Da Vinci^® *
• DV-Prime™ *
• Spin-Processor™ *

* Note: You will be leaving the Lam Research Corporation website.