{"id":13175,"date":"2018-01-11T14:01:05","date_gmt":"2018-01-11T22:01:05","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/product\/metryx\/"},"modified":"2021-07-26T00:29:25","modified_gmt":"2021-07-26T07:29:25","slug":"metryx","status":"publish","type":"product","link":"https:\/\/www.lamresearch.com\/de\/product\/metryx\/","title":{"rendered":"METRYX PRODUKTFAMILIE"},"content":{"rendered":"

In-Line-Prozess\u00fcberwachung wird verwendet, um Entwicklungen und Abweichungen bei Produktionswafern zu erkennen, w\u00e4hrend sie sich ereignen, so dass schnell Korrekturen vorgenommen werden k\u00f6nnen, um weiteren Ausbeuteverlust zu verhindern. F\u00fcr Abtragungs-, \u00c4tz- und Reinigungsschritte ist das Vermessen der Massenver\u00e4nderung eines Wafers vor und nach einer Fertigung ein einfacher und direkter Weg, die Fertigungsergebnisse zu \u00fcberwachen und zu pr\u00fcfen, insbesondere bei ultrad\u00fcnnen und ultradicken Schichten\/Filmen und bei komplexen 3D-Geometrien neuerer Chipdesigns, bei denen traditionelle optische Messtechniken unwirksam sind.<\/p>\n

Lams Metryx\u00ae<\/sup>-Massenmetrologiesysteme, die sowohl als plattform-integrierte Module als auch als Einzelsysteme verf\u00fcgbar sind, liefern Sub-Milligramm-Massenmessungen f\u00fcr die Fertigungs\u00fcberwachung und -steuerung von dreidimensionalen Bauteilstrukturen.<\/p>\n","protected":false},"excerpt":{"rendered":"

Unsere Massemesssysteme bieten Messm\u00f6glichkeiten im Milligrammbereich f\u00fcr erweiterte Prozess\u00fcberwachung und Steuerung dreidimensionaler Ger\u00e4testrukturen.<\/p>\n","protected":false},"author":31,"featured_media":17482,"parent":0,"menu_order":162,"template":"","meta":{"_acf_changed":false,"_relevanssi_hide_post":"","_relevanssi_hide_content":"","_relevanssi_pin_for_all":"","_relevanssi_pin_keywords":"","_relevanssi_unpin_keywords":"","_relevanssi_related_keywords":"","_relevanssi_related_include_ids":"","_relevanssi_related_exclude_ids":"","_relevanssi_related_no_append":"","_relevanssi_related_not_related":"","_relevanssi_related_posts":"","_relevanssi_noindex_reason":"","footnotes":""},"process":[555],"solution":[634,321,325,315,330,349,345,352],"technology":[556],"class_list":["post-13175","product","type-product","status-publish","has-post-thumbnail","hentry","process-mass-metrology-de","solution-advanced-packaging-de","solution-analog-mixed-signal-de","solution-discrete-power-devices-de","solution-advanced-memory-de","solution-interconnect-de","solution-sensors-transducers-de","solution-patterning-de","solution-transistor-de","technology-mass-metrology-de"],"acf":[],"yoast_head":"\nMETRYX PRODUKTFAMILIE - Lam Research<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.lamresearch.com\/product\/metior\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"METRYX PRODUKTFAMILIE - Lam Research\" \/>\n<meta property=\"og:description\" content=\"Unsere Massemesssysteme bieten Messm\u00f6glichkeiten im Milligrammbereich f\u00fcr erweiterte Prozess\u00fcberwachung und Steuerung dreidimensionaler Ger\u00e4testrukturen.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.lamresearch.com\/product\/metior\/\" \/>\n<meta property=\"og:site_name\" content=\"Lam Research\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/LamResearchCorporation\" \/>\n<meta property=\"article:modified_time\" content=\"2021-07-26T07:29:25+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2021\/07\/HX-Close-Up-2.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"533\" \/>\n\t<meta property=\"og:image:height\" content=\"542\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:site\" content=\"@lamresearch\" \/>\n<meta name=\"twitter:label1\" content=\"Gesch\u00e4tzte Lesezeit\" \/>\n\t<meta name=\"twitter:data1\" content=\"1 Minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.lamresearch.com\\\/product\\\/metior\\\/\",\"url\":\"https:\\\/\\\/www.lamresearch.com\\\/product\\\/metior\\\/\",\"name\":\"METRYX PRODUKTFAMILIE - 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Die B\u00f6den von Strukturen mit hohem Querschnittsverh\u00e4ltnis (HAR) k\u00f6nnten zum Beispiel f\u00fcr optische Top-Down-Signale unsichtbar sein. Ebenso sind manche dicken Lacke oftmals zu undurchsichtig f\u00fcr genaue Dickenmessungen, und laterale Verarbeitungsschritte finden h\u00e4ufig zu tief in einer Struktur statt, als dass sie sichtbar w\u00e4ren. Viele Geometrien sind heute so komplex, dass L\u00f6sungen f\u00fcr optische kritische Abmessungen (OCD) teure Investitionen und lange Entwicklungs- und Validierungszeitr\u00e4ume ben\u00f6tigen. Dar\u00fcber hinaus erfordern die strengen Anforderungen f\u00fcr \u00c4tzanwendungen oftmals Methoden in Echtzeit, um den Variabilit\u00e4tsgraden innerhalb eines Lots und von Lot zu Lot gerecht zu werden. 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