{"id":13181,"date":"2018-01-24T16:38:19","date_gmt":"2018-01-25T00:38:19","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/product\/reliant-deposition-products\/"},"modified":"2023-09-18T11:04:58","modified_gmt":"2023-09-18T18:04:58","slug":"reliant-deposition-products","status":"publish","type":"product","link":"https:\/\/www.lamresearch.com\/de\/product\/reliant-deposition-products\/","title":{"rendered":"Reliant-Abscheidungsprodukte"},"content":{"rendered":"<p>Bei der Herstellung von Chips wird im Rahmen von Abscheidungsprozessen eine Vielzahl von leitenden und isolierenden Materialien auf den Wafer aufgebracht, aus denen die Bauteile und die Verdrahtung eines Halbleiterbauelements bestehen. F\u00fcr M\u00e4rkte wie mikroelektromechanische Systeme (MEMS) und Leistungsbauelemente stellen die zahlreichen Funktionsmerkmale und unterschiedlichen Materialien zus\u00e4tzliche Anforderungen an die Fertigung.<\/p>\n<p>Die Reliant\u00ae-Beschichtungsproduktfamilie von Lam unterst\u00fctzt Roadmaps f\u00fcr Spezialtechnologien und verl\u00e4ngert die produktive Nutzungsdauer von Fabs.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Unsere Reliant-Abscheidungsprodukte unterst\u00fctzen Roadmaps f\u00fcr Spezialtechnologien und verl\u00e4ngern die produktive Lebensdauer von Fabs. 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