{"id":14580,"date":"2020-03-02T11:41:56","date_gmt":"2020-03-02T19:41:56","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/?post_type=product&#038;p=14580"},"modified":"2023-09-06T15:44:37","modified_gmt":"2023-09-06T22:44:37","slug":"sense-i","status":"publish","type":"product","link":"https:\/\/www.lamresearch.com\/de\/product\/sense-i\/","title":{"rendered":"SENSE.I PRODUKTFAMILIE"},"content":{"rendered":"<p>Plasma\u00e4tzschritte werden f\u00fcr die selektive Entfernung von Materialien verwendet, um die gew\u00fcnschten Strukturen und Muster von Halbleiterbauelementen zu erzeugen. Aufgrund der zunehmenden Miniaturisierung der Bauteile werden pr\u00e4zise und wiederholbare \u00c4tzschritte immer wichtiger, um die erforderlichen Eigenschaften und Gr\u00f6\u00dfen der Strukturen herzustellen. Die Verwendung neuer sensibler Materialien und komplexer Architekturen stellen dabei zus\u00e4tzliche Herausforderungen dar.<\/p>\n<p>Basierend auf der Technologie unserer am Markt f\u00fchrenden Kiyo<sup>\u00ae<\/sup> und Flex<sup>\u00ae<\/sup> Prozessmodule bietet die Sense.i\u2122 Produktfamilie die hohe Leistungsf\u00e4higkeit, die ben\u00f6tigt wird, um modernste Strukturgr\u00f6\u00dfen pr\u00e4zise und mit gleichm\u00e4\u00dfiger Qualit\u00e4t herzustellen. Sense.i\u2122 bietet differenzierte Technologien und anwendungsspezifische Prozessf\u00e4higkeiten f\u00fcr kritische und semi-kritische \u00c4tzanwendungen. Die innovative Systemarchitektur erf\u00fcllt h\u00f6chste Anspr\u00fcche an die Produktivit\u00e4t und Wiederholbarkeit der Prozesse und unterst\u00fctzt die zuk\u00fcnftigen Anforderungen f\u00fcr Logikbauelemente und Halbleiterspeicher f\u00fcr die laufende Dekade und dar\u00fcber hinaus.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Unsere neueste \u00c4tzplattform bietet beispiellose Systemintelligenz in einer kompakten Architektur mit hoher Dichte, um Prozessleistung bei h\u00f6chster Produktivit\u00e4t zu erzielen.<\/p>\n","protected":false},"author":29,"featured_media":14600,"parent":0,"menu_order":6,"template":"","meta":{"_acf_changed":false,"_relevanssi_hide_post":"","_relevanssi_hide_content":"","_relevanssi_pin_for_all":"","_relevanssi_pin_keywords":"","_relevanssi_unpin_keywords":"","_relevanssi_related_keywords":"","_relevanssi_related_include_ids":"","_relevanssi_related_exclude_ids":"","_relevanssi_related_no_append":"","_relevanssi_related_not_related":"","_relevanssi_related_posts":"","_relevanssi_noindex_reason":"","footnotes":""},"process":[377],"solution":[632,315,330,345,352],"technology":[582,259],"class_list":["post-14580","product","type-product","status-publish","has-post-thumbnail","hentry","process-etch-de","solution-advanced-packaging","solution-advanced-memory-de","solution-interconnect-de","solution-patterning-de","solution-transistor-de","technology-deep-reactive-ion-etch-drie","technology-reactive-ion-etch-de"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - 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