{"id":1813,"date":"2017-09-07T14:28:02","date_gmt":"2017-09-07T21:28:02","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/product\/dv-prime-da-vinci\/"},"modified":"2024-03-18T09:40:01","modified_gmt":"2024-03-18T16:40:01","slug":"dv-prime-da-vinci","status":"publish","type":"product","link":"https:\/\/www.lamresearch.com\/de\/product\/dv-prime-da-vinci\/","title":{"rendered":"DV-PRIME UND DA VINCI <br> Produktfamilie"},"content":{"rendered":"<p>Reinigungsschritte werden w\u00e4hrend der Herstellung von Halbleitern wiederholt durchgef\u00fchrt und sind ein kritischer Prozess, der die Produktausbeute und die -zuverl\u00e4ssigkeit beeinflusst. Unerw\u00fcnschte mikroskopische Materialien &#8211; manche nicht gr\u00f6\u00dfer als die winzigen Strukturen selbst &#8211; m\u00fcssen effektiv gereinigt werden. Gleichzeitig m\u00fcssen mit diesen Vorg\u00e4ngen selektive Reststoffe entfernt werden, die der Halbleiterschicht chemisch gleichen.<\/p>\n<p>Unsere Produkte der DV-Prime\u00ae und Da Vinci\u00ae Serie basierend auf Lams Vorreiterrolle in der Single-Wafer-Technologie. Sie vereinen die ben\u00f6tigte Anwendungsflexibilit\u00e4t bei gleichzeitig hoher Produktivit\u00e4t, um w\u00e4hrend des Fertigungsablaufs eine gro\u00dfe Bandbreite von Wafer-Reinigungsschritten zu adressieren. Um niedrigere Gesamtbetriebskosten bei bew\u00e4hrter Qualit\u00e4t und Leistung zu erreichen, sind f\u00fcr einige Prozesse ausgew\u00e4hlte Modelle auch \u00fcber unsere Reliant<sup>\u00ae<\/sup>-Systeme als general\u00fcberholte Produkte erh\u00e4ltlich.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Diese Produkte bieten die Prozessflexibilit\u00e4t, die bei hoher Produktivit\u00e4t erforderlich ist, um mehrere Waferreinigungsschritte in der gesamten Fertigung abzudecken.<\/p>\n","protected":false},"author":31,"featured_media":10756,"parent":0,"menu_order":213,"template":"","meta":{"_acf_changed":false,"_relevanssi_hide_post":"","_relevanssi_hide_content":"","_relevanssi_pin_for_all":"","_relevanssi_pin_keywords":"","_relevanssi_unpin_keywords":"","_relevanssi_related_keywords":"","_relevanssi_related_include_ids":"","_relevanssi_related_exclude_ids":"","_relevanssi_related_no_append":"","_relevanssi_related_not_related":"","_relevanssi_related_posts":"","_relevanssi_noindex_reason":"","footnotes":""},"process":[399],"solution":[634,321,325,330,333,349,345,352],"technology":[735],"class_list":["post-1813","product","type-product","status-publish","has-post-thumbnail","hentry","process-strip-clean-de","solution-advanced-packaging-de","solution-analog-mixed-signal-de","solution-discrete-power-devices-de","solution-interconnect-de","solution-optoelectronics-photonics-de","solution-sensors-transducers-de","solution-patterning-de","solution-transistor-de","technology-wet-clean-de"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - 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Jeder Schritt weist unterschiedliche Anforderungen betreffend Selektivit\u00e4t und Defektivit\u00e4t auf, die den Fertigungsablauf noch komplexer machen. Beispielsweise m\u00fcssen Nach\u00e4tz- oder Nachgl\u00fchpolymere und Reststoffe entfernt werden, indem man sie chemisch aufl\u00f6st, wohingegen unl\u00f6sbare Partikel gehoben und abgetragen werden. Diese komplexen Anforderungen haben zu einer st\u00e4rkeren Anwendung von mehreren chemischen Vorg\u00e4ngen in einem Verfahren gef\u00fchrt. Daher ist die kosteneffektive Verwendung von Prozesschemikalien von wachsender Bedeutung. Bei der Reinigung von Strukturen mit hohem Aspektverh\u00e4ltnis m\u00fcssen Reststoffe vollkommen entfernt werden, ohne dass es zu mechanischen Sch\u00e4den oder zu gr\u00f6\u00dferen Aussparungen an den Seitenw\u00e4nden kommt.<\/p>\n","key_benefits":["Hocheffiziente Partikelentfernung\r\n","Flexibilit\u00e4t, um mit den neuesten  verd\u00fcnnten Chemikalien und L\u00f6sungsmitteln die notwendigen Defektivit\u00e4tsanforderungen zu erf\u00fcllen.\r\n","Verringerte Partikel-Addierzahl und geringere Ausbeuteabweichungen durch kompakte, On-board-Zufuhr der Chemikalien\r\n","Niedrigere Kosten f\u00fcr Chemikalien durch Rezirkulation\r\n","Verringerter Ausschuss  durch  fragile  Strukturen aufgrund der Verwendung hochentwickelter Trockentechnologie\r\n"],"product_offerings":["DV-Prime<sup>\u00ae<\/sup>","Da Vinci<sup>\u00ae<\/sup>"],"key_applications":["Entfernung von Partikeln, Polymeren und R\u00fcckst\u00e4nden","R\u00fcckseiten-\/Waferrandreinigung","Nasschemische Fotolackentfernung","D\u00fcnnen von Wafern\/Spannungsentlastung (stress relief) des Siliziumsubstrates","Underbump-Metallisierungs\u00e4tzen"],"featured_media_src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/DV-Prime_Products_1920x600.jpg","drawer_background_image":{"id":10756,"src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/DV-Prime_Products_1920x600.jpg"},"_links":{"self":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/1813","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/types\/product"}],"author":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/users\/31"}],"version-history":[{"count":0,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/1813\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media\/10756"}],"wp:attachment":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media?parent=1813"}],"wp:term":[{"taxonomy":"process","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/process?post=1813"},{"taxonomy":"solution","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/solution?post=1813"},{"taxonomy":"technology","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/technology?post=1813"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}