{"id":1818,"date":"2017-09-07T14:26:49","date_gmt":"2017-09-07T21:26:49","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/product\/eos\/"},"modified":"2024-03-18T11:49:48","modified_gmt":"2024-03-18T18:49:48","slug":"eos","status":"publish","type":"product","link":"https:\/\/www.lamresearch.com\/de\/product\/eos\/","title":{"rendered":"EOS Produktfamilie"},"content":{"rendered":"<p>Wafer-Nassreinigung wird zwischen Chip-Fertigungsschritten eingesetzt, um R\u00fcckst\u00e4nde zu entfernen und Defekte am Chip zu minimieren. Die fortschreitende Miniaturisierung der Bauelemente, immer komplexere Strukturen und neue Werkstoffe bringen zus\u00e4tzliche Herausforderungen f\u00fcr die Vermeidung von M\u00e4ngeln und Defekte mit sich und treiben auch die Notwendigkeit f\u00fcr verbesserte Wafer-Reinigungsproduktivit\u00e4t voran.<\/p>\n<p>Mit den neuesten Nassreinigungsprodukten von Lam liefert EOS<sup>\u00ae<\/sup> au\u00dfergew\u00f6hnlich niedrige On-Wafer-Defektivit\u00e4t und hohen Durchsatz, um den zunehmend anspruchsvollen Wafer-Reinigungsanwendungen gerecht zu werden, einschlie\u00dflich der entstehenden 3D-Strukturen.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Unsere modernen Wet Clean-Produkte bieten au\u00dfergew\u00f6hnlich geringe Defekte auf dem Wafer bei hohem Durchsatz f\u00fcr zunehmend anspruchsvolle Anwendungen. <\/p>\n","protected":false},"author":31,"featured_media":10506,"parent":0,"menu_order":222,"template":"","meta":{"_acf_changed":false,"_relevanssi_hide_post":"","_relevanssi_hide_content":"","_relevanssi_pin_for_all":"","_relevanssi_pin_keywords":"","_relevanssi_unpin_keywords":"","_relevanssi_related_keywords":"","_relevanssi_related_include_ids":"","_relevanssi_related_exclude_ids":"","_relevanssi_related_no_append":"","_relevanssi_related_not_related":"","_relevanssi_related_posts":"","_relevanssi_noindex_reason":"","footnotes":""},"process":[399],"solution":[315,330,345,352],"technology":[735],"class_list":["post-1818","product","type-product","status-publish","has-post-thumbnail","hentry","process-strip-clean-de","solution-advanced-memory-de","solution-interconnect-de","solution-patterning-de","solution-transistor-de","technology-wet-clean-de"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>EOS Produktfamilie - Lam Research<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.lamresearch.com\/product\/eos\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"EOS Produktfamilie - Lam Research\" \/>\n<meta property=\"og:description\" content=\"Unsere modernen Wet Clean-Produkte bieten au\u00dfergew\u00f6hnlich geringe Defekte auf dem Wafer bei hohem Durchsatz f\u00fcr zunehmend anspruchsvolle Anwendungen.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.lamresearch.com\/product\/eos\/\" \/>\n<meta property=\"og:site_name\" content=\"Lam Research\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/LamResearchCorporation\" \/>\n<meta property=\"article:modified_time\" content=\"2024-03-18T18:49:48+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/EOS_Products_1920x600.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1920\" \/>\n\t<meta property=\"og:image:height\" content=\"600\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:site\" content=\"@lamresearch\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.lamresearch.com\\\/product\\\/eos\\\/\",\"url\":\"https:\\\/\\\/www.lamresearch.com\\\/product\\\/eos\\\/\",\"name\":\"EOS Produktfamilie - Lam Research\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.lamresearch.com\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.lamresearch.com\\\/product\\\/eos\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.lamresearch.com\\\/product\\\/eos\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.lamresearch.com\\\/wp-content\\\/uploads\\\/2017\\\/09\\\/EOS_Products_1920x600.jpg\",\"datePublished\":\"2017-09-07T21:26:49+00:00\",\"dateModified\":\"2024-03-18T18:49:48+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.lamresearch.com\\\/product\\\/eos\\\/#breadcrumb\"},\"inLanguage\":\"de-DE\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.lamresearch.com\\\/product\\\/eos\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"de-DE\",\"@id\":\"https:\\\/\\\/www.lamresearch.com\\\/product\\\/eos\\\/#primaryimage\",\"url\":\"https:\\\/\\\/www.lamresearch.com\\\/wp-content\\\/uploads\\\/2017\\\/09\\\/EOS_Products_1920x600.jpg\",\"contentUrl\":\"https:\\\/\\\/www.lamresearch.com\\\/wp-content\\\/uploads\\\/2017\\\/09\\\/EOS_Products_1920x600.jpg\",\"width\":1920,\"height\":600},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.lamresearch.com\\\/product\\\/eos\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.lamresearch.com\\\/de\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Products\",\"item\":\"https:\\\/\\\/www.lamresearch.com\\\/ko\\\/lam_products\\\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"EOS Produktfamilie\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.lamresearch.com\\\/#website\",\"url\":\"https:\\\/\\\/www.lamresearch.com\\\/\",\"name\":\"Lam Research\",\"description\":\"Engineering At The Atomic Scale\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.lamresearch.com\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.lamresearch.com\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"de-DE\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.lamresearch.com\\\/#organization\",\"name\":\"Lam Research\",\"url\":\"https:\\\/\\\/www.lamresearch.com\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"de-DE\",\"@id\":\"https:\\\/\\\/www.lamresearch.com\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/www.lamresearch.com\\\/wp-content\\\/uploads\\\/2021\\\/07\\\/lam_research_logo_corporate.png\",\"contentUrl\":\"https:\\\/\\\/www.lamresearch.com\\\/wp-content\\\/uploads\\\/2021\\\/07\\\/lam_research_logo_corporate.png\",\"width\":188,\"height\":30,\"caption\":\"Lam Research\"},\"image\":{\"@id\":\"https:\\\/\\\/www.lamresearch.com\\\/#\\\/schema\\\/logo\\\/image\\\/\"},\"sameAs\":[\"https:\\\/\\\/www.facebook.com\\\/LamResearchCorporation\",\"https:\\\/\\\/x.com\\\/lamresearch\",\"https:\\\/\\\/www.instagram.com\\\/lam_research\\\/\",\"https:\\\/\\\/www.linkedin.com\\\/company\\\/lam-research\",\"https:\\\/\\\/www.youtube.com\\\/user\\\/LamResearchCorp\"]}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"EOS Produktfamilie - Lam Research","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.lamresearch.com\/product\/eos\/","og_locale":"de_DE","og_type":"article","og_title":"EOS Produktfamilie - Lam Research","og_description":"Unsere modernen Wet Clean-Produkte bieten au\u00dfergew\u00f6hnlich geringe Defekte auf dem Wafer bei hohem Durchsatz f\u00fcr zunehmend anspruchsvolle Anwendungen.","og_url":"https:\/\/www.lamresearch.com\/product\/eos\/","og_site_name":"Lam Research","article_publisher":"https:\/\/www.facebook.com\/LamResearchCorporation","article_modified_time":"2024-03-18T18:49:48+00:00","og_image":[{"width":1920,"height":600,"url":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/EOS_Products_1920x600.jpg","type":"image\/jpeg"}],"twitter_card":"summary_large_image","twitter_site":"@lamresearch","schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.lamresearch.com\/product\/eos\/","url":"https:\/\/www.lamresearch.com\/product\/eos\/","name":"EOS Produktfamilie - Lam Research","isPartOf":{"@id":"https:\/\/www.lamresearch.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.lamresearch.com\/product\/eos\/#primaryimage"},"image":{"@id":"https:\/\/www.lamresearch.com\/product\/eos\/#primaryimage"},"thumbnailUrl":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/EOS_Products_1920x600.jpg","datePublished":"2017-09-07T21:26:49+00:00","dateModified":"2024-03-18T18:49:48+00:00","breadcrumb":{"@id":"https:\/\/www.lamresearch.com\/product\/eos\/#breadcrumb"},"inLanguage":"de-DE","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.lamresearch.com\/product\/eos\/"]}]},{"@type":"ImageObject","inLanguage":"de-DE","@id":"https:\/\/www.lamresearch.com\/product\/eos\/#primaryimage","url":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/EOS_Products_1920x600.jpg","contentUrl":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/EOS_Products_1920x600.jpg","width":1920,"height":600},{"@type":"BreadcrumbList","@id":"https:\/\/www.lamresearch.com\/product\/eos\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.lamresearch.com\/de\/"},{"@type":"ListItem","position":2,"name":"Products","item":"https:\/\/www.lamresearch.com\/ko\/lam_products\/"},{"@type":"ListItem","position":3,"name":"EOS Produktfamilie"}]},{"@type":"WebSite","@id":"https:\/\/www.lamresearch.com\/#website","url":"https:\/\/www.lamresearch.com\/","name":"Lam Research","description":"Engineering At The Atomic Scale","publisher":{"@id":"https:\/\/www.lamresearch.com\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.lamresearch.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"de-DE"},{"@type":"Organization","@id":"https:\/\/www.lamresearch.com\/#organization","name":"Lam Research","url":"https:\/\/www.lamresearch.com\/","logo":{"@type":"ImageObject","inLanguage":"de-DE","@id":"https:\/\/www.lamresearch.com\/#\/schema\/logo\/image\/","url":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2021\/07\/lam_research_logo_corporate.png","contentUrl":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2021\/07\/lam_research_logo_corporate.png","width":188,"height":30,"caption":"Lam Research"},"image":{"@id":"https:\/\/www.lamresearch.com\/#\/schema\/logo\/image\/"},"sameAs":["https:\/\/www.facebook.com\/LamResearchCorporation","https:\/\/x.com\/lamresearch","https:\/\/www.instagram.com\/lam_research\/","https:\/\/www.linkedin.com\/company\/lam-research","https:\/\/www.youtube.com\/user\/LamResearchCorp"]}]}},"process_terms":[{"term_id":399,"name":"Strippen und Reinigen","slug":"strip-clean-de","taxonomy":"process","parent":0,"order":0}],"solution_terms":[{"term_id":315,"name":"Erweiterter Speicher","slug":"advanced-memory-de","taxonomy":"solution","parent":0,"order":0},{"term_id":330,"name":"Interconnect","slug":"interconnect-de","taxonomy":"solution","parent":0,"order":0},{"term_id":345,"name":"Strukturierung","slug":"patterning-de","taxonomy":"solution","parent":0,"order":0},{"term_id":352,"name":"Transistor","slug":"transistor-de","taxonomy":"solution","parent":0,"order":0}],"technology_terms":[{"term_id":735,"name":"Wet Clean","slug":"wet-clean-de","taxonomy":"technology","parent":0,"order":0}],"industry_challenges":"<p>Wafer-Reinigung ist eine \u00e4u\u00dferst wichtige Funktion, die bei der Halbleiterfertigung viele Male wiederholt werden muss. Da die Strukturbreiten unter 10 nm sinken und neue Werkstoffe eingef\u00fchrt werden, w\u00e4chst die Zahl der Reinigungsschritte mit aggressiver Schnelligkeit. Immer aufwendigere Reinigungsvorg\u00e4nge f\u00fchren zu l\u00e4ngeren Fertigungszeiten und zur Notwendigkeit gr\u00f6\u00dferer Produktivit\u00e4t insgesamt. Fortschrittliche Reinigungsschritte werden ben\u00f6tigt, um den zus\u00e4tzlichen technischen Anforderungen gerecht zu werden. Mehrfache Strukturierungsans\u00e4tze verlangen beispielsweise nach makelloser Trocknung und schadensfreier Partikelentfernung. Reinigungsvorg\u00e4nge, mit denen Werkstoffverluste kontrolliert werden, sind f\u00fcr FinFET, 3D NAND und anderen 3D-Bauelemente \u00e4u\u00dferst wichtig. Um Waferkr\u00fcmmung und Spannungsstress in 3D NAND Strukturen modulieren und regulieren zu k\u00f6nnen, ist es erforderlich, Filme von der Waferr\u00fcckseite zu entfernen und kontrollierte Profile sicherzustellen.<\/p>\n","key_benefits":["Niedrige Defektivit\u00e4t durch innovatives Kammerdesign\r\n","Optimierter hoher Durchsatz mit bis zu 16 Prozesskammern\r\n","Propriet\u00e4re Technologie f\u00fcr gerades\/neigungsfreies Trocknen von Strukturen mit hohen Aspektverh\u00e4ltnissen","\u00c4u\u00dferst g\u00fcnstiges Cost-of-Ownership durch hoch-effiziente R\u00fcckgewinnung von L\u00f6sungsmitteln\r\n","Pr\u00e4zise steuerbare Profile bei der R\u00fcckseitenfilmentfernung durch eine einzigartige Waferspann-Technologie (Chuck-Technology)\r\n"],"product_offerings":["EOS<sup>\u00ae<\/sup>"],"key_applications":["Entfernung von Partikeln, Polymeren und R\u00fcckst\u00e4nden","R\u00fcckseiten-\/Waferrandreinigung und Schicht-\/Filmentfernung",""],"featured_media_src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/EOS_Products_1920x600.jpg","drawer_background_image":{"id":10506,"src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/EOS_Products_1920x600.jpg"},"_links":{"self":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/1818","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/types\/product"}],"author":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/users\/31"}],"version-history":[{"count":0,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/1818\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media\/10506"}],"wp:attachment":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media?parent=1818"}],"wp:term":[{"taxonomy":"process","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/process?post=1818"},{"taxonomy":"solution","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/solution?post=1818"},{"taxonomy":"technology","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/technology?post=1818"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}