{"id":1823,"date":"2017-09-07T14:02:40","date_gmt":"2017-09-07T21:02:40","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/product\/flex-product-family\/"},"modified":"2019-07-12T16:17:35","modified_gmt":"2019-07-12T23:17:35","slug":"flex-product-family","status":"publish","type":"product","link":"https:\/\/www.lamresearch.com\/de\/product\/flex-product-family\/","title":{"rendered":"FLEX PRODUKTFAMILIE"},"content":{"rendered":"<p>Dielektrisches \u00c4tzen arbeitet Muster in isolierende Materialen ein und schafft damit Trennw\u00e4nde zwischen den elektrisch leitenden Teilen von Halbleiterbauelementen. Bei modernen Bauteilen sind diese Strukturen oftmals \u00e4u\u00dferst hoch und d\u00fcnn und werden aus komplexen, empfindlichen Materialien hergestellt. Kleinste Abweichungen vom Zielprofil der Strukturen \u2013 sogar auf atomarer Ebene \u2013 k\u00f6nnen negative Auswirkungen auf die elektrischen Eigenschaften des Bauteils haben.<\/p>\n<p>Um diese herausfordernden Strukturen genauestens herstellen zu k\u00f6nnen, bietet Lams Flex<sup>\u00ae<\/sup>-Produktfamilie differenzierte Technologien und auf Anwendung konzentrierte M\u00f6glichkeiten f\u00fcr kritische dielektrische \u00c4tzverfahren. F\u00fcr manche Anwendungen sind \u00fcber unsere Reliant<sup>\u00ae<\/sup>-Systeme auch ausgew\u00e4hlte Modelle als general\u00fcberholte Anlagen verf\u00fcgbar und bieten niedrigere Betriebskosten mit der gleichen Qualit\u00e4t und Leistung wie neue Systeme.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Die dielektrischen \u00c4tzsysteme von Lam bieten anwendungsorientierte Funktionen zum Erstellen einer Vielzahl anspruchsvoller Strukturen in modernen Ger\u00e4ten.<\/p>\n","protected":false},"author":31,"featured_media":10762,"parent":0,"menu_order":232,"template":"","meta":{"_acf_changed":false,"_relevanssi_hide_post":"","_relevanssi_hide_content":"","_relevanssi_pin_for_all":"","_relevanssi_pin_keywords":"","_relevanssi_unpin_keywords":"","_relevanssi_related_keywords":"","_relevanssi_related_include_ids":"","_relevanssi_related_exclude_ids":"","_relevanssi_related_no_append":"","_relevanssi_related_not_related":"","_relevanssi_related_posts":"","_relevanssi_noindex_reason":"","footnotes":""},"process":[377],"solution":[634,634,321,325,315,330,333,345,352],"technology":[304,787,259],"class_list":{"0":"post-1823","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","5":"hentry","6":"process-etch-de","7":"solution-advanced-packaging-de","9":"solution-analog-mixed-signal-de","10":"solution-discrete-power-devices-de","11":"solution-advanced-memory-de","12":"solution-interconnect-de","13":"solution-optoelectronics-photonics-de","14":"solution-patterning-de","15":"solution-transistor-de","16":"technology-atomic-layer-etch-ale-de","17":"technology-kryogenes-atzen","18":"technology-reactive-ion-etch-de"},"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - 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