{"id":1828,"date":"2017-09-07T14:04:20","date_gmt":"2017-09-07T21:04:20","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/product\/gamma-product-family\/"},"modified":"2021-08-04T16:14:38","modified_gmt":"2021-08-04T23:14:38","slug":"gamma-product-family","status":"publish","type":"product","link":"https:\/\/www.lamresearch.com\/de\/product\/gamma-product-family\/","title":{"rendered":"GAMMA Produktfamilie"},"content":{"rendered":"<p>Strippingverfahren entfernen Fotolack und weitere R\u00fcckst\u00e4nde, die bei anderen Prozessen zur\u00fcckbleiben. Downstream-Plasmavorg\u00e4nge werden ebenfalls verwendet, um der Wafer-Oberfl\u00e4che bestimmte Eigenschaften zu verleihen, die f\u00fcr weitere Verfahren notwendig sind. Entfernungsprozesse sind wichtig f\u00fcr die endg\u00fcltige Leistung der Bauelemente und m\u00fcssen eine minimale Beeintr\u00e4chtigung der Strukturformen (CDs) sicherstellen und ebenso einen minimalen bis gar keinen Materialverlust.<\/p>\n<p>Lams fertigungsbew\u00e4hrte Systeme aus der GAMMA<sup>\u00ae<\/sup>-Produktfamilie mit einer gro\u00dfen Bandbreite aus Downstream-Plasmen bietet die Fertigungsflexibilit\u00e4t, die f\u00fcr mehrere wichtige Wafer-Bearbeitungsvorg\u00e4nge n\u00f6tig sind.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Diese Produkte bieten die Prozessflexibilit\u00e4t, die erforderlich ist, um ein breites Spektrum kritischer Photoresiststreifenanwendungen abzudecken.<\/p>\n","protected":false},"author":31,"featured_media":10768,"parent":0,"menu_order":243,"template":"","meta":{"_acf_changed":false,"_relevanssi_hide_post":"","_relevanssi_hide_content":"","_relevanssi_pin_for_all":"","_relevanssi_pin_keywords":"","_relevanssi_unpin_keywords":"","_relevanssi_related_keywords":"","_relevanssi_related_include_ids":"","_relevanssi_related_exclude_ids":"","_relevanssi_related_no_append":"","_relevanssi_related_not_related":"","_relevanssi_related_posts":"","_relevanssi_noindex_reason":"","footnotes":""},"process":[],"solution":[330,345,352],"technology":[288],"class_list":["post-1828","product","type-product","status-publish","has-post-thumbnail","hentry","solution-interconnect-de","solution-patterning-de","solution-transistor-de","technology-dry-strip-de"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - 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Auf Transistorebene beeintr\u00e4chtigen kleine Ver\u00e4nderungen des Lacks als Ergebnis des Strippingprozesses den Widerstand und die Tiefe der Kontaktstellen sowie die Dotierstoffaktivierung und damit auch die Leistung des Bauteils. Bei durchkontaktierten Strukturen k\u00f6nnen ungewollte Ver\u00e4nderungen der Eigenschaften von Low-k-Dielektrika die Leistung ebenfalls beeintr\u00e4chtigen. Die Entfernung von Fotolack kann ebenfalls negative Auswirkungen auf Materialien haben, die in fortschrittlichen Speicheranwendungen verwendet werden. Diese \u00dcberlegungen treiben die Entwicklung neuer Strippingprozesse f\u00fcr modernste Chiptechnologien. Zu den Anforderungen geh\u00f6ren das Entfernen von R\u00fcckst\u00e4nden, das Minimieren von Oxidation und Siliziumverlust und das Erbringen von Ergebnissen ohne Sch\u00e4den am Bauteil, die zugleich hohen Durchsatz und niedrige Betriebskosten erm\u00f6glichen.<\/p>\n","key_benefits":["Mehrere Verfahrensschritte k\u00f6nnen mit maximaler Flexibilit\u00e4t und Produktivit\u00e4t auf derselben Plattform durchgef\u00fchrt werden, erm\u00f6glicht durch den \u201eMulti-Station Sequential Processing\u201c-Aufbau (MSSP), der eine unabh\u00e4ngige Steuerung von Temperatur, RF-Leistung und Chemie erm\u00f6glicht","R\u00fcckstandlose Ergebnisse mit hohem Durchsatz f\u00fcr Bulk und Implant Strip Anwendungen aufgrund verbesserter Quelltechnologie in Verbindung mit schnellerer Wafer-Erw\u00e4rmung","Ultraniedrige Defektivit\u00e4t eines einzigen Systems, das eine Vielzahl von Prozessanwendungen und -chemikalien erlaubt"],"product_offerings":["GAMMA<sup>\u00ae<\/sup> xPR","GAMMA<sup>\u00ae<\/sup> GxT<sup>\u00ae<\/sup>"],"key_applications":["Hochdosierter Implant Strip (HDIS)","Bulk Strip","Descumming Prozess"],"featured_media_src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/GAMMA_Products_1920x600.jpg","drawer_background_image":{"id":10768,"src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/GAMMA_Products_1920x600.jpg"},"_links":{"self":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/1828","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/types\/product"}],"author":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/users\/31"}],"version-history":[{"count":0,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/1828\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media\/10768"}],"wp:attachment":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media?parent=1828"}],"wp:term":[{"taxonomy":"process","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/process?post=1828"},{"taxonomy":"solution","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/solution?post=1828"},{"taxonomy":"technology","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/technology?post=1828"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}