{"id":1838,"date":"2017-09-07T13:57:15","date_gmt":"2017-09-07T20:57:15","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/product\/sola-product-family\/"},"modified":"2021-08-04T10:19:53","modified_gmt":"2021-08-04T17:19:53","slug":"sola-product-family","status":"publish","type":"product","link":"https:\/\/www.lamresearch.com\/de\/product\/sola-product-family\/","title":{"rendered":"SOLA Produktfamilie"},"content":{"rendered":"<p>Neuere dielektrische Materialien, die dazu gedacht sind, die Isolationsanforderungen der j\u00fcngsten Chips zu erf\u00fcllen, besitzen oftmals Eigenschaften, durch die sie ungew\u00f6hnlich schwer zu verwenden sind. Diese Filme k\u00f6nnen leicht besch\u00e4digt werden und sind anf\u00e4llig daf\u00fcr, einige ihrer Isolationsf\u00e4higkeiten einzub\u00fc\u00dfen, was zu einer schlechten Leistung des Bauteils f\u00fchren kann.<\/p>\n<p>Um diese fortschrittlichen Filmanwendungen zu erm\u00f6glichen, k\u00f6nnen einige Schichten stabilisiert und andere verbessert werden, um die Ger\u00e4teleistung zu verbessern. Dazu werden spezielle Filmbehandlungen nach der Beschichtung eingesetzt, die mit Lams SOLA<sup>\u00ae<\/sup> UVTP-Produktfamilie erh\u00e4ltlich sind.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Diese Produktfamilie bietet spezielle Nachbehandlungsfilmbehandlungen zur Verbesserung der physikalischen Eigenschaften f\u00fcr fortgeschrittene Folienanwendungen.<\/p>\n","protected":false},"author":31,"featured_media":10798,"parent":0,"menu_order":207,"template":"","meta":{"_acf_changed":false,"_relevanssi_hide_post":"","_relevanssi_hide_content":"","_relevanssi_pin_for_all":"","_relevanssi_pin_keywords":"","_relevanssi_unpin_keywords":"","_relevanssi_related_keywords":"","_relevanssi_related_include_ids":"","_relevanssi_related_exclude_ids":"","_relevanssi_related_no_append":"","_relevanssi_related_not_related":"","_relevanssi_related_posts":"","_relevanssi_noindex_reason":"","footnotes":""},"process":[361],"solution":[330,352],"technology":[248],"class_list":["post-1838","product","type-product","status-publish","has-post-thumbnail","hentry","process-deposition-de","solution-interconnect-de","solution-transistor-de","technology-ultraviolet-thermal-processing-uvtp-de"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - 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Isolierfilme mit niedrigen dieleketrischen Konstanten (k) sind \u00e4u\u00dferst wichtig f\u00fcr eine kontinuierliche Skalierung. Der hohe Kohlenstoffanteil und die Porosit\u00e4t, die den k-Wert einer Schicht reduzieren, machen sie zudem br\u00fcchig und schadensanf\u00e4llig. Dar\u00fcber hinaus k\u00f6nnen Vorg\u00e4nge wie \u00c4tzen, Abschlacken\/Entfernen und Nassreinigen Low-k-Materialien besch\u00e4digen und den effektiven k-Wert beispielsweise durch Kohlenstoffverlust oder Wasseranreicherung erh\u00f6hen. Aufgrund dessen sind Methoden zur Ultraviolett-W\u00e4rmebehandlung (UVTP) n\u00f6tig, um die mechanische Belastbarkeit der Filme zu st\u00e4rken, Poren bildende Grundstoffe (Porenbildner) zu entfernen und die Integrit\u00e4t der Low-k-Filme zu gew\u00e4hrleisten. UVTP kann au\u00dferdem verwendet werden, um die Belastung von Front-End-of-Line-(FEOL-)Nitridschichten zu erh\u00f6hen, um die Leistung des Bauteils zu verbessern.<\/p>\n","key_benefits":["Branchenf\u00fchrende Filmeigenschaften, In-Wafer- und Wafer-zu-Wafer-Gleichm\u00e4\u00dfigkeit sowie Produktivit\u00e4t\r\n","Verbesserte physikalische Eigenschaften von bereits aufgetragenen Schichten durch Modifikationen mit einem patentierten Behandlungsvorgang (Exposition durch ultraviolettes Licht, Gase und D\u00e4mpfe sowie W\u00e4rme)\r\n","Prozessflexibilit\u00e4t durch unabh\u00e4ngige Steuerung von Temperatur, Wellenl\u00e4nge und Intensit\u00e4t an jeder Station des Wafer-Wegs durch einen Aufbau mit Multi-Station Sequential Processing (MSSP)\r\n"],"product_offerings":["SOLA<sup>\u00ae<\/sup> Excel"],"key_applications":["Low-k-Filmbehandlung","Behandlung von belasteten Nitridschichten"],"featured_media_src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/SOLA_Products_1920x600.jpg","drawer_background_image":{"id":10798,"src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/SOLA_Products_1920x600.jpg"},"_links":{"self":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/1838","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/types\/product"}],"author":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/users\/31"}],"version-history":[{"count":0,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/1838\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media\/10798"}],"wp:attachment":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media?parent=1838"}],"wp:term":[{"taxonomy":"process","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/process?post=1838"},{"taxonomy":"solution","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/solution?post=1838"},{"taxonomy":"technology","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/technology?post=1838"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}