{"id":1843,"date":"2017-09-07T14:28:47","date_gmt":"2017-09-07T21:28:47","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/product\/sp-series-product-family\/"},"modified":"2024-03-18T11:51:40","modified_gmt":"2024-03-18T18:51:40","slug":"sp-series-product-family","status":"publish","type":"product","link":"https:\/\/www.lamresearch.com\/de\/product\/sp-series-product-family\/","title":{"rendered":"SP-SERIE Produktfamilie"},"content":{"rendered":"<p>F\u00fcr Nassreinigungsschritte, die zwischen Prozessschritten des Packaging und der externen Verdrahtung angewandt werden, gibt es im Bereich des fortschrittlichen Wafer-Level-Packaging (WLP) komplexe Anforderungen. Nassreinigungsprozesse entfernen bestimmte Materialien vollkommen und lassen andere br\u00fcchige Strukturen unbeschadet.<\/p>\n<p>Mit einer gro\u00dfen Bandbreite von m\u00f6glichen Prozessen bieten die Produkte der SP-Serie kosteneffiziente, in der Fertigung bew\u00e4hrte Nassreinigungs-\/Nass\u00e4tz-L\u00f6sungen f\u00fcr anspruchsvolle WLP-Anwendungen. Um niedrigere Gesamtbetriebskosten bei bew\u00e4hrter Qualit\u00e4t und Leistung zu erreichen, sind f\u00fcr einige Prozesse ausgew\u00e4hlte Modelle auch \u00fcber unsere Reliant<sup>\u00ae<\/sup>-Systeme als general\u00fcberholte Produkte erh\u00e4ltlich.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Diese bew\u00e4hrte Produktfamilie bietet zuverl\u00e4ssige, kosteng\u00fcnstige Nassreinigungs- \/ Nass\u00e4tzl\u00f6sungen, mit denen unerw\u00fcnschte Materialien vorsichtig vom Wafer entfernt werden.<\/p>\n","protected":false},"author":31,"featured_media":10804,"parent":0,"menu_order":217,"template":"","meta":{"_acf_changed":false,"_relevanssi_hide_post":"","_relevanssi_hide_content":"","_relevanssi_pin_for_all":"","_relevanssi_pin_keywords":"","_relevanssi_unpin_keywords":"","_relevanssi_related_keywords":"","_relevanssi_related_include_ids":"","_relevanssi_related_exclude_ids":"","_relevanssi_related_no_append":"","_relevanssi_related_not_related":"","_relevanssi_related_posts":"","_relevanssi_noindex_reason":"","footnotes":""},"process":[399],"solution":[634,321,325,333,349],"technology":[735],"class_list":["post-1843","product","type-product","status-publish","has-post-thumbnail","hentry","process-strip-clean-de","solution-advanced-packaging-de","solution-analog-mixed-signal-de","solution-discrete-power-devices-de","solution-optoelectronics-photonics-de","solution-sensors-transducers-de","technology-wet-clean-de"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - 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Aufgrund der gro\u00dfen Strukturbreitensind au\u00dferdem hoher Durchsatz und niedrige Fertigungskosten wichtig.<\/p>\n","key_benefits":["Hohe Produktivit\u00e4t und Flexibilit\u00e4t\r\n","Ausgezeichnete Prozessgleichm\u00e4\u00dfigkeit  und -wiederholbarkeit (sowohl auf einzelnen Wafern, von Wafer zu Wafer, und von Los zu Los)\r\n","Anlagenseitiger Schutz durch Bernoulli-Chuck\r\n","Verminderte Betriebskosten durch die Rezirkulation mehrerer Chemikalien\r\n","Flexible Konfiguration: Anlagen mit Einzel, Doppel- oder Vierfachkammern;  Handling f\u00fcr ultrad\u00fcnne Wafer mit einem Durchmesser von 150 bis 300 mm\r\n"],"product_offerings":["SP203L","SP223","SP323"],"key_applications":["D\u00fcnnen von Wafern\/Spannungsentlastung (stress relief) des Siliziumsubstrates","Underbump-Metallisierungs\u00e4tzen","Nasschemische Fotolackentfernung","Reinigung nach L\u00f6tung\/post-deflux clean"],"featured_media_src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/SP_Series_Products_1920x600.jpg","drawer_background_image":{"id":10804,"src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/SP_Series_Products_1920x600.jpg"},"_links":{"self":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/1843","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/types\/product"}],"author":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/users\/31"}],"version-history":[{"count":0,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/1843\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media\/10804"}],"wp:attachment":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media?parent=1843"}],"wp:term":[{"taxonomy":"process","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/process?post=1843"},{"taxonomy":"solution","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/solution?post=1843"},{"taxonomy":"technology","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/technology?post=1843"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}