{"id":1848,"date":"2017-09-07T13:56:27","date_gmt":"2017-09-07T20:56:27","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/product\/speed-product-family\/"},"modified":"2021-08-04T10:20:00","modified_gmt":"2021-08-04T17:20:00","slug":"speed-product-family","status":"publish","type":"product","link":"https:\/\/www.lamresearch.com\/de\/product\/speed-product-family\/","title":{"rendered":"SPEED Produktfamilie"},"content":{"rendered":"<p>Dielektrische &#8222;Gapfill&#8220;-Verfahren lagern kritische Isolationsschichten zwischen leitenden und \/ oder aktiven Bereichen ab, indem \u00d6ffnungen mit verschiedenen Seitenverh\u00e4ltnissen zwischen leitenden Leitungen und zwischen Bauelementen gef\u00fcllt werden. Bei Bauteilen j\u00fcngster Generation k\u00f6nnen die zu f\u00fcllenden Strukturen sehr hoch\/tief und eng sein. Daher sind wegen des st\u00e4ndig wachsenden Risikos von Wechselwirkungen und Bauteilversagen hochgradige dielektrische Schichten besonders wichtig.<\/p>\n<p>Lams HDP-CVD-Produkte von SPEED<sup>\u00ae<\/sup> bieten mehrere L\u00f6sungen mit dielektrischen Filmen f\u00fcr hochgradiges Gap-Filling mit branchenf\u00fchrendem Durchsatz und Verl\u00e4sslichkeit. F\u00fcr einige Anwendungen sind ausgew\u00e4hlte Modelle auch \u00fcber unsere Reliant<sup>\u00ae<\/sup> -Systeme als general\u00fcberholte Produkte erh\u00e4ltlich, wodurch niedrigere Betriebskosten mit der gleichen Qualit\u00e4t und Leistung wie bei neuen Systemen erzielt werden.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Diese dielektrischen Abscheidungsprodukte bieten eine vollst\u00e4ndige L\u00fccke in R\u00e4umen mit hohem Aspektverh\u00e4ltnis und branchenf\u00fchrendem Durchsatz und Zuverl\u00e4ssigkeit.<\/p>\n","protected":false},"author":31,"featured_media":10811,"parent":0,"menu_order":227,"template":"","meta":{"_acf_changed":false,"_relevanssi_hide_post":"","_relevanssi_hide_content":"","_relevanssi_pin_for_all":"","_relevanssi_pin_keywords":"","_relevanssi_unpin_keywords":"","_relevanssi_related_keywords":"","_relevanssi_related_include_ids":"","_relevanssi_related_exclude_ids":"","_relevanssi_related_no_append":"","_relevanssi_related_not_related":"","_relevanssi_related_posts":"","_relevanssi_noindex_reason":"","footnotes":""},"process":[361],"solution":[325,315,330,333,349,352],"technology":[281],"class_list":["post-1848","product","type-product","status-publish","has-post-thumbnail","hentry","process-deposition-de","solution-discrete-power-devices-de","solution-advanced-memory-de","solution-interconnect-de","solution-optoelectronics-photonics-de","solution-sensors-transducers-de","solution-transistor-de","technology-high-density-plasma-chemical-vapor-deposition-hdp-cvd-de"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - 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