{"id":1873,"date":"2017-08-11T09:20:48","date_gmt":"2017-08-11T16:20:48","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/product\/sabre\/"},"modified":"2021-08-04T10:19:46","modified_gmt":"2021-08-04T17:19:46","slug":"sabre","status":"publish","type":"product","link":"https:\/\/www.lamresearch.com\/de\/product\/sabre\/","title":{"rendered":"SABRE Produktfamilie"},"content":{"rendered":"<p>Kupferbeschichtungen bilden die elektrische Verdrahtung f\u00fcr die fortschrittlichsten Halbleiterbauteile. Selbst der kleinste Defekt \u2013 zum Beispiel mikroskopisch gro\u00dfe Stiftl\u00f6cher oder Staubpartikel \u2013 in diesen Leiterstrukturen kann die Leistung des Bauteils beeintr\u00e4chtigen, angefangen vom Geschwindigkeitsverlust bis hin zu v\u00f6lligem Versagen.<\/p>\n<p>Lams SABRE<sup>\u00ae<\/sup> ECD Produktlinie, die Vorreiter bei der Umstellung auf Kupferverbindungen war, bietet die Pr\u00e4zision und Produktivit\u00e4t, die f\u00fcr die Kupfermetallisierung in Fertigungslinien n\u00f6tig ist.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Diese Produktfamilie bietet auf der produktivit\u00e4tsf\u00fchrenden ECD-Plattform der Branche Pr\u00e4zisionsmetallisierung f\u00fcr die Kupfer-Damascene-Herstellung.<\/p>\n","protected":false},"author":31,"featured_media":10847,"parent":0,"menu_order":172,"template":"","meta":{"_acf_changed":false,"_relevanssi_hide_post":"","_relevanssi_hide_content":"","_relevanssi_pin_for_all":"","_relevanssi_pin_keywords":"","_relevanssi_unpin_keywords":"","_relevanssi_related_keywords":"","_relevanssi_related_include_ids":"","_relevanssi_related_exclude_ids":"","_relevanssi_related_no_append":"","_relevanssi_related_not_related":"","_relevanssi_related_posts":"","_relevanssi_noindex_reason":"","footnotes":""},"process":[361],"solution":[315,330],"technology":[283],"class_list":["post-1873","product","type-product","status-publish","has-post-thumbnail","hentry","process-deposition-de","solution-advanced-memory-de","solution-interconnect-de","technology-electrochemical-deposition-ecd-de"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - 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Die Herausforderungen f\u00fcr Beschichtungen mit Kupfer (Cu) umschlie\u00dfen fehlerfreie F\u00fcllungen, wenige Defektel, geringen Widerstand und die F\u00e4higkeit, Strukturen mit hohem Querschnittverh\u00e4ltnis (HAR) auszuf\u00fcllen und gleichzeitig hohe Produktionsleistungen zu erbringen. Die kontinuierliche Ausd\u00fcnnung von Trennwand-\/Startstacks zusammen mit schrumpfenden Linienst\u00e4rken erfordert immer striktere Prozesskontrollen, um eine ausreichende F\u00fcllgeschwindigkeit von unten nach oben zu erreichen, w\u00e4hrend die Startschicht gesch\u00fctzt wird. Die Vielf\u00e4ltigkeit von Bauteilstrukturen auf einer einzelnen Logikebene erfordert ein breites Prozessfenster, um die einwandfreie Bef\u00fcllung von Strukturen mit variierenden Querschnittverh\u00e4ltnissen, Startschichtabdeckungen und Dichten zu gew\u00e4hrleisten.<\/p>\n","key_benefits":["Fehlerfreie Bef\u00fcllung mit hohem Durchsatz und h\u00f6chster Defektdichtenleistung f\u00fcr fortschrittliche \r\n","Weitestes Prozessfenster und h\u00f6chste Zuwachsgeschwindigkeit von unten nach oben, um die anspruchsvollsten HAR-Strukturen auszuf\u00fcllen\r\n","Direkte Beschichtung mit Cu auf unterschiedlichen Mantelmaterialien, wichtig f\u00fcr Metallisierungsprozesse der n\u00e4chsten Generation\r\n","Technologien, die die Startschicht bei der Initiierung der Galvanisierung sch\u00fctzen und gleichzeitig eine ausgezeichnete gleichm\u00e4\u00dfige Bef\u00fcllung   \u00fcber den gesamten Wafer gew\u00e4hrleisten\r\n","Vergr\u00f6\u00dferter nutzbare Ausbeutebereich durch branchenf\u00fchrend optimierten Randausschluss zur Erh\u00f6hung der Zahl der Ausbeutechips pro Wafer\r\n"],"product_offerings":["SABRE<sup>\u00ae<\/sup> Extreme","SABRE<sup>\u00ae<\/sup> Max","SABRE<sup>\u00ae<\/sup> Excel"],"key_applications":["Logik Verbindung","Speicher-Verbindung"],"featured_media_src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/08\/SABRE_Products_1920x600.jpg","drawer_background_image":{"id":10847,"src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/08\/SABRE_Products_1920x600.jpg"},"_links":{"self":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/1873","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/types\/product"}],"author":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/users\/31"}],"version-history":[{"count":0,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/1873\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media\/10847"}],"wp:attachment":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media?parent=1873"}],"wp:term":[{"taxonomy":"process","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/process?post=1873"},{"taxonomy":"solution","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/solution?post=1873"},{"taxonomy":"technology","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/technology?post=1873"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}