{"id":1878,"date":"2017-09-07T13:47:05","date_gmt":"2017-09-07T20:47:05","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/product\/sabre-3d\/"},"modified":"2025-08-31T23:02:50","modified_gmt":"2025-09-01T06:02:50","slug":"sabre-3d","status":"publish","type":"product","link":"https:\/\/www.lamresearch.com\/de\/product\/sabre-3d\/","title":{"rendered":"SABRE 3D Produktfamilie"},"content":{"rendered":"<p>Kupfer und andere Metalle werden abgelagert um elektrische Verbindungen herzustellen, die f\u00fcr modernstes Wafer-Level-Packaging (WLP) und f\u00fcr Strukturen mit Silizium-Durchkontaktierung (TSV) verwendet werden. Diese winzigen Leiterteile helfen dabei, die Bauteilabmessungen zu verringern, um kleinere, schnellere und leistungsst\u00e4rkere elektronische Mobilger\u00e4te herzustellen.<\/p>\n<p>Die Produktfamilie von SABRE<sup>\u00ae<\/sup> 3D verbindet Lams bew\u00e4hrte SABRE Electrofill<sup>\u00ae<\/sup>-Technologie mit weiteren Innovationen, um hochgradige Filme zu liefern, die f\u00fcr Anwendungen mit WLP und TSV bei hoher Produktivit\u00e4t notwendig sind.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Dank unserer bew\u00e4hrten Electrofill-Technologie liefern diese hochproduktiven Systeme hochwertige Metallfolien f\u00fcr moderne Verpackungsanwendungen.<\/p>\n","protected":false},"author":31,"featured_media":11206,"parent":0,"menu_order":178,"template":"","meta":{"_acf_changed":false,"_relevanssi_hide_post":"","_relevanssi_hide_content":"","_relevanssi_pin_for_all":"","_relevanssi_pin_keywords":"","_relevanssi_unpin_keywords":"","_relevanssi_related_keywords":"","_relevanssi_related_include_ids":"","_relevanssi_related_exclude_ids":"","_relevanssi_related_no_append":"","_relevanssi_related_not_related":"","_relevanssi_related_posts":"","_relevanssi_noindex_reason":"","footnotes":""},"process":[361],"solution":[634],"technology":[283],"class_list":["post-1878","product","type-product","status-publish","has-post-thumbnail","hentry","process-deposition-de","solution-advanced-packaging-de","technology-electrochemical-deposition-ecd-de"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - 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Obwohl sie der Kupferbef\u00fcllung f\u00fcr Back-End-of-Line-Damaszenung (BEOL) \u00e4hnlich ist, findet die Galvanisierung f\u00fcr WLP und TSV auf einem weit h\u00f6heren Ma\u00dfstab statt \u2013 auf dem Ma\u00dfstab von Mikronen (10-6 m) im Gegensatz zu Angstr\u00f6m (10-10 m) der Schicht, die abgeschieden werden soll. Dies erfordert oftmals lange Abscheidungszeiten und eine mehrschrittige Verarbeitung. Zu den Herausforderungen geh\u00f6ren die Gleichm\u00e4\u00dfigkeit i \u00fcber den gesamten Wafer und die Koplanarit\u00e4t innerhalb des Bauteils bei hohen Beschichtungsgraten, reduzierte Betriebskosten, die Verminderung von Defekten und das Erreichen von zuverl\u00e4ssigen und fehlerfreien Mikrobumps und L\u00f6tverbindungen.<\/p>\n","key_benefits":["H\u00f6here Beschichtungsraten, ohne Beeintr\u00e4chtigung derGleichm\u00e4\u00dfigkeiten innerhalb des Bauteils und innerhalb des Wafers\r\n","Hardware- und Fertigungsregler, um die Ausbeute und den Systemaussto\u00df zu verbessern\r\n","Flexibilit\u00e4t f\u00fcr vielf\u00e4ltige Packaginganwendungen mit modularem Aufbau, die durch Mehrfachbeschichtung und Pr\u00e4-\/Postbehandlungszellen konfiguriert werden k\u00f6nnen\r\n","Niedrige Betriebskosten geeignet f\u00fcr kostensensible Umgebungen und Prozesse, einschlie\u00dflich Technologien zur signifikanten Senkung der Kosten f\u00fcr SnAg-Chemie \r\n"],"product_offerings":["SABRE<sup>\u00ae<\/sup> 3D","SABRE<sup>\u00ae<\/sup> 3D xT"],"key_applications":["TSV","Kupfers\u00e4ule (Copper Pillar)","Redistribution Layers  (RDL)","Underbump-Metallisierungs\u00e4tzen","Bleihaltiges oder bleifreies C4-Bumping","Cu\/SnAg und Ni\/Au Microbumps","High-density-fan-out (HDFO) Anwendungen (Megas\u00e4ulen, RDL, 2-in-1-Durchkontaktierung, Mikros\u00e4ulen)"],"featured_media_src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/SABRE_3D_Products_1920x600.jpg","drawer_background_image":{"id":11206,"src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2017\/09\/SABRE_3D_Products_1920x600.jpg"},"_links":{"self":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/1878","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/types\/product"}],"author":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/users\/31"}],"version-history":[{"count":0,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/1878\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media\/11206"}],"wp:attachment":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media?parent=1878"}],"wp:term":[{"taxonomy":"process","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/process?post=1878"},{"taxonomy":"solution","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/solution?post=1878"},{"taxonomy":"technology","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/technology?post=1878"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}