{"id":19527,"date":"2022-02-09T05:18:15","date_gmt":"2022-02-09T13:18:15","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/?post_type=product&#038;p=19527"},"modified":"2023-09-06T15:44:34","modified_gmt":"2023-09-06T22:44:34","slug":"selective-etch-product-family","status":"publish","type":"product","link":"https:\/\/www.lamresearch.com\/de\/product\/selective-etch-product-family\/","title":{"rendered":"Selective Etch Produktfamilie"},"content":{"rendered":"<p>Die Serie selektiver \u00c4tzl\u00f6sungen von Lam erm\u00f6glicht den isotropen Abtrag von Materialien von Wafer-Oberfl\u00e4chen ohne jegliche Modifizierung oder Besch\u00e4digung angrenzender Materialien. Die selektiven \u00c4tzl\u00f6sungen von Lam, die ultrahohe Selektivit\u00e4t und Pr\u00e4zision im \u00c5ngstr\u00f6m-Ma\u00dfstab bieten, wurden entwickelt, um die Anforderungen von Chipherstellern bez\u00fcglich der Entwicklung fortschrittlicher 3D-Logik- und Speicherstrukturen zu erf\u00fcllen.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Bahnbrechendes Portfolio erm\u00f6glicht den isotropen Materialabtrag mit Pr\u00e4zision im \u00c5ngstr\u00f6m-Ma\u00dfstab und ultrahohe Selektionsf\u00e4higkeiten f\u00fcr 3D-Architekturen und fortschrittliche Logik- und Foundryanwendungen.<\/p>\n","protected":false},"author":31,"featured_media":19523,"parent":0,"menu_order":4,"template":"","meta":{"_acf_changed":false,"_relevanssi_hide_post":"","_relevanssi_hide_content":"","_relevanssi_pin_for_all":"","_relevanssi_pin_keywords":"","_relevanssi_unpin_keywords":"","_relevanssi_related_keywords":"","_relevanssi_related_include_ids":"","_relevanssi_related_exclude_ids":"","_relevanssi_related_no_append":"","_relevanssi_related_not_related":"","_relevanssi_related_posts":"","_relevanssi_noindex_reason":"","footnotes":""},"process":[377],"solution":[315,330,345,352],"technology":[617,612],"class_list":["post-19527","product","type-product","status-publish","has-post-thumbnail","hentry","process-etch-de","solution-advanced-memory-de","solution-interconnect-de","solution-patterning-de","solution-transistor-de","technology-selective-etch-de","technology-selektives-atzen"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - 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Weil FinFET-Bauelemente allm\u00e4hlich an die Grenzen ihrer Skalierbarkeit sto\u00dfen, stellen f\u00fchrende Chiphersteller ihre Produktion auf Gate-all-around(GAA)- oder Nanosheet-Strukturen um. Was Speicherchips betrifft, so wurde der Schwerpunkt von NAND-Flashzellen bereits erfolgreich auf dreidimensionale Strukturen umgestellt, und DRAM (Dynamic Random Access Memory) d\u00fcrfte in K\u00fcrze folgen.<\/p>\n<p>Diese technologischen Wendepunkte machen einen dreidimensionalen Ansatz zur Chipherstellung erforderlich, bei dem Materialien sowohl selektiv als auch isotrop \u2013 oder einheitlich in alle Richtungen \u2013 von den Wafer-Oberfl\u00e4chen abgetragen werden. Um das zu erreichen, ben\u00f6tigen Chiphersteller neue und au\u00dferordentlich komplexe Fertigungsverfahren, mit denen bisher unvorstellbare Prozesse wie das vertikale und laterale Formen von Funktionsmerkmalen im Nanoma\u00dfstab m\u00f6glich werden \u2013 Prozesse, die eine Pr\u00e4zision auf \u00c5ngstr\u00f6m-Ebene erfordern, um den Abtrag, die Ver\u00e4nderung oder das Besch\u00e4digen anderer kritischer Materialschichten w\u00e4hrend des \u00c4tzens zu verhindern.<\/p>\n<hr style=\"margin: 28px 0px 10px 0px;\" \/>\n<p><span class=\"font-MessinaSerif-RegularItalic\" style=\"color: #20a785; font-size: 20px;\"><strong>Lams bahnbrechende Serie an selektiven \u00c4tzl\u00f6sungen bietet die ultrahohe Selektivit\u00e4t und die Pr\u00e4zisions-\u00c4tzf\u00e4higkeiten, die f\u00fcr die Entwicklung und Herstellung fortschrittlicher 3D-Logik- und Speicherchipstrukturen ben\u00f6tigt werden.<\/strong><\/span><\/p>\n<hr style=\"margin: 10px 0px;\" \/>\n","key_benefits":["Der isotrope Materialabtrag in Verbindung mit einer Pr\u00e4zision im \u00c5ngstr\u00f6m-Bereich erm\u00f6glicht selbst bei extrem hohen H\u00f6hen\/Breiten-Verh\u00e4ltnissen eine optimale Chipleistung.","Eine Prozesssteuerung im atomaren Ma\u00dfstab verhindert den Verlust kritischer Materialien, unerw\u00fcnschte Oberfl\u00e4chenmodifizierungen oder Besch\u00e4digungen, die zu einer Qualit\u00e4tsminderung des Chips und zu Chipdefekten f\u00fchren k\u00f6nnen.","Fortschrittliche Oberfl\u00e4chenbehandlungen zur Steuerung physikalischer und elektrischer Grenzfl\u00e4cheneigenschaften","Umfassende Auswahl von isotropen \u00c4tztechnologien, neuartigen chemischen Merkmalen und Einstellbarkeit zur Unterst\u00fctzung eines zuk\u00fcnftigen Skalierungsbedarfs.","Bahnbrechende Behandlung und Aufbereitung f\u00fcr Waferoberfl\u00e4chen zur Verbesserung der Ger\u00e4tegeschwindigkeit und -leistung"],"product_offerings":["Argos<sup>\u00ae<\/sup>","Prevos\u2122","Selis<sup>\u00ae<\/sup>"],"key_applications":["Dummy-Poly-Abtrag","SiGe-Abtrag (GAA)","Oxid-Recess","Silizium-Trimmen","Vorreinigung bei der Emitter-\/Kollektor-Abscheidung","Entfernung von Low-k-Material","Dekontaminierung und Modifizierung von Oberfl\u00e4chen"],"featured_media_src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2022\/02\/Selective-Etch-Product-Page-Bnaner.jpg","drawer_background_image":{"id":19523,"src":"https:\/\/www.lamresearch.com\/wp-content\/uploads\/2022\/02\/Selective-Etch-Product-Page-Bnaner.jpg"},"_links":{"self":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/19527","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/types\/product"}],"author":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/users\/31"}],"version-history":[{"count":0,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/product\/19527\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media\/19523"}],"wp:attachment":[{"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/media?parent=19527"}],"wp:term":[{"taxonomy":"process","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/process?post=19527"},{"taxonomy":"solution","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/solution?post=19527"},{"taxonomy":"technology","embeddable":true,"href":"https:\/\/www.lamresearch.com\/de\/wp-json\/wp\/v2\/technology?post=19527"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}