{"id":22199,"date":"2023-10-27T15:46:45","date_gmt":"2023-10-27T22:46:45","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/?post_type=product&p=22199"},"modified":"2024-04-02T12:42:11","modified_gmt":"2024-04-02T19:42:11","slug":"phoenix-product-family","status":"publish","type":"product","link":"https:\/\/www.lamresearch.com\/de\/product\/phoenix-product-family\/","title":{"rendered":"Phoenix-Produktfamilie"},"content":{"rendered":"

Phoenix bietet eine vollautomatische Hochvolumen-Plattenverarbeitung f\u00fcr 510×515\u00a0mm gro\u00dfe Substrate.<\/p>\n

Entwickelt mit dem Ziel, die Betriebskosten neu zu definieren, bietet Phoenix einzigartige Technologien in der Panel-Level-Packaging-Industrie sowie eine respektvolle Nutzung der Betriebsmittel.<\/p>\n

Inspiriert von der Leistung auf Waferebene bietet Phoenix L\u00f6sungen in den Bereichen Strippen, Entwicklung, \u00c4tzen und Beschichtung, um den zuk\u00fcnftigen Marktanforderungen gerecht zu werden, die durch KI, High-Performance-Computing und andere Anwendungen entstehen.<\/p>\n","protected":false},"excerpt":{"rendered":"

Phoenix bietet eine vollautomatische, hochvolumige Plattenverarbeitung f\u00fcr 510×515\u00a0mm gro\u00dfe Substrate an.<\/p>\n","protected":false},"author":31,"featured_media":21953,"parent":0,"menu_order":0,"template":"","meta":{"_acf_changed":false,"_relevanssi_hide_post":"","_relevanssi_hide_content":"","_relevanssi_pin_for_all":"","_relevanssi_pin_keywords":"","_relevanssi_unpin_keywords":"","_relevanssi_related_keywords":"","_relevanssi_related_include_ids":"","_relevanssi_related_exclude_ids":"","_relevanssi_related_no_append":"","_relevanssi_related_not_related":"","_relevanssi_related_posts":"","_relevanssi_noindex_reason":"","footnotes":""},"process":[7,696,668,399],"solution":[634,321,669,325,315,697,670,333,698],"technology":[283,700,699,252],"class_list":["post-22199","product","type-product","status-publish","has-post-thumbnail","hentry","process-deposition","process-plattenverarbeitung","process-semsysco-de","process-strip-clean-de","solution-advanced-packaging-de","solution-analog-mixed-signal-de","solution-automobilindustrie","solution-discrete-power-devices-de","solution-advanced-memory-de","solution-fortschrittliche-substrate","solution-mini-mikro-led","solution-optoelectronics-photonics-de","solution-panel-level-fanout-de","technology-electrochemical-deposition-ecd-de","technology-fotolack-entwicklung","technology-fotolack-strippen","technology-spin-wet-clean-de"],"acf":[],"yoast_head":"\nPhoenix-Produktfamilie 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