{"id":12186,"date":"2018-02-21T20:35:29","date_gmt":"2018-02-22T04:35:29","guid":{"rendered":"https:\/\/lamrstage.wpengine.com\/products\/our-solutions\/patterning-solutions\/"},"modified":"2021-07-29T11:46:13","modified_gmt":"2021-07-29T18:46:13","slug":"patterning-solutions","status":"publish","type":"page","link":"https:\/\/www.lamresearch.com\/ko\/products\/our-solutions\/patterning-solutions\/","title":{"rendered":"Patterning Solutions"},"content":{"rendered":"","protected":false},"excerpt":{"rendered":"","protected":false},"author":31,"featured_media":8115,"parent":2455,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"_relevanssi_hide_post":"","_relevanssi_hide_content":"","_relevanssi_pin_for_all":"","_relevanssi_pin_keywords":"","_relevanssi_unpin_keywords":"","_relevanssi_related_keywords":"","_relevanssi_related_include_ids":"","_relevanssi_related_exclude_ids":"","_relevanssi_related_no_append":"","_relevanssi_related_not_related":"","_relevanssi_related_posts":"","_relevanssi_noindex_reason":"","footnotes":""},"class_list":["post-12186","page","type-page","status-publish","has-post-thumbnail","hentry"],"acf":[],"yoast_head":"\nPatterning Solutions | Our Solutions | Lam Research<\/title>\n<meta name=\"description\" content=\"Patterning involves the set of process steps \u2013 including lithography, deposition, and etch \u2013 that create the extremely small, intricate features of an integrated circuit. With each new generation, device dimensions continue to shrink. For advanced structures, these feature sizes can be too small and\/or packed too closely together for conventional lithography, the step that transfers the chip design\u2019s intricate detail from the mask \u201ctemplate\u201d onto the wafer. To compensate, chipmakers are using advanced techniques like double\/quadruple and spacer-based patterning, involving multiple masks and process sets. Even as these approaches ease lithography limitations, they create new demands for exceptional process precision and film quality in order to accurately produce the fine, dense features required.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.lamresearch.com\/products\/our-solutions\/patterning-solutions\/\" \/>\n<meta property=\"og:locale\" content=\"ko_KR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Patterning Solutions | Our Solutions | Lam Research\" \/>\n<meta property=\"og:description\" content=\"Patterning involves the set of process steps \u2013 including lithography, deposition, and etch \u2013 that create the extremely small, intricate features of an integrated circuit. With each new generation, device dimensions continue to shrink. 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