Accelerating Beyond the Limits of Scaling
The future of technology is being shaped by the increasing prevalence of electronic devices, from smartphones and tablets to computers and gaming systems. The push for artificial intelligence (AI) is driving the need for more efficient and powerful processing hardware and demanding new semiconductor architectures.
Advanced packaging is a key enabler for overcoming traditional scaling limits and meeting future computing needs. In addition to shrinking transistors, chipmakers are looking beyond the chip into diverse packaging architectures that enhance processing power, memory, speed, and energy efficiency through 3D integration and chiplet technologies.
A pivotal moment for
advanced packaging
Advanced packaging technologies and chiplet designs are essential for meeting the demands of next-generation devices in our technological future. Without solving for today’s advanced packaging challenges, the AI revolution will stall just as it begins to transform the industry.
Without continued advancement in advanced packaging technologies, industries counting on AI-driven transformation—from healthcare to transportation to energy—will see their innovation roadmaps extended by years, not quarters.
This pivotal moment will determine how quickly humanity can solve its most pressing problems through computational advances. The ability to overcome today’s advanced packaging hurdles will directly impact our capacity to develop life-saving medical treatments, create sustainable energy solutions, and build intelligent systems that will define our future prosperity.
How Lam Research is driving innovation with velocity
From plating to etch, advanced packaging requires extreme precision at each step of the chipmaking process. Lam’s approach leverages our decades of leadership in etch and deposition to deliver best-in-class products that allow our customers to build next generation chips with unmatched precision, performance and speed.
Lam’s advanced packaging portfolio centers on three critical innovation areas that address the semiconductor industry’s most pressing challenges:
- Large-Format Package Interconnect Leadership: Enabling larger AI packages—scaling from 3.3x to 5.5x to 9x reticle size—across both wafer and panel platforms to meet the growing demands of high-performance computing.
- High-Yield Die-to-Wafer (D2W) Assembly: Driving innovations in materials and process solutions for increasingly critical applications in die-to-wafer bonding that enable advanced memory and logic scaling.
- Novel Wafer Shape/Stress Management: Pioneering solutions for 3D wafer-on-wafer (3D-WoW) stacking that address critical challenges in wafer bowing, twisting, and bond integrity.
Our Solutions
Lam’s advanced packaging portfolio enables more powerful AI accelerators to
- Overcome the memory wall
- Support increased I/O count
- Allow for more energy-efficient computing
—all while maintaining reliability and yield essential for commercial success.
Our advanced packaging solutions deliver superior technical performance across all critical parameters: uniformity, yield, process control, and throughput. With industry-leading metrology integration and process capabilities, Lam tools provide the precision and reliability required for today’s most challenging packaging applications.
WETS Product Line
Delivering leading solutions in electroplating and wet processing including photoresist strip, etch and clean
DV-Prime & Da Vinci 제품군
Wet Clean
제조 전반에 걸쳐 웨이퍼 세정의 여러 단계를 높은 생산성으로 처리하는 데 필요한 공정 유연성을 갖추고 있습니다.
SP 시리즈 제품군
Wet Clean
성능이 검증된 이 제품군은 뛰어난 신뢰성과 비용 효과로 웨이퍼에서 불필요한 물질을 부드럽게 제거하는 습식 세정/습식 식각 솔루션입니다.
SABRE 제품군
Electrochemical Deposition (ECD)
이 제품군은 업계 최고의 생산성을 자랑하는 ECD 플랫폼에서 구리 다마신을 제조할 때 필요한 고정밀 금속 도금 기능이 있습니다.
SABRE 3D 제품군
Electrochemical Deposition (ECD)
이 고생산성 시스템은 램리서치의 검증된 전기충진(Electrofill) 기술을 사용하여 첨단 패키징 분야에 필요한 양질의 금속막을 만듭니다.
Dry Etch Solutions
High-productivity solutions to overcome technically challenging requirements in advanced packaging, such as high-aspect -ratio etch (TSV, TDV & TGV) and plasma dicing
FLEX 제품군
Atomic Layer Etch (ALE) Reactive Ion Etch (RIE) 극저온 식각 극저온 식각
램리서치의 유전체 식각 시스템은 용도에 맞춘 기능 덕분에 고급 소자의 까다로운 구조를 다양하게 만들 수 있습니다.
KIYO 제품군
Reactive Ion Etch (RIE)
시장을 선도하는 램리서치의 전도체 식각 제품은 주요 소자 피처(feature)에 요구되는 고성능 정밀도와 제어력이 특징입니다.
Syndion 제품군
Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE)
딥 식각 응용 부문에서 이 제품군은 고종횡비 피처를 형성하는 데 필요한 우수한 웨이퍼 균일도 제어 능력을 제공합니다.
Dielectric and Metal Deposition
Differentiated solutions for PECVD, ALD, and CVD metals. Enabling various film requirements for advanced packaging, including high-bond- strength dielectric, high quality inter-die gapfill film, and film stress tunability for wafer stress and shape management
Striker 제품군
원자층 증착(ALD)
첨단 ALD 기술을 사용하여 나노 수준의 피처가 있는 고급 소자의 주요 공정을 완벽하게 제어하는 유전막을 제공합니다.
VECTOR 제품군
Plasma-Enhanced Chemical Vapor Deposition (PECVD)
램리서치의 PECVD 제품군은 광범위한 소자 분야에서 높은 생산성으로 고정밀 유전막 증착을 실현합니다.
ALTUS 제품군
Chemical Vapor Deposition (CVD) 원자층 증착(ALD)
CVD 및 ALD 기술을 결합하여 시장을 선도하는 이 시스템은 고급 텅스텐 금속화 응용 분야를 위한 고도의 등각 금속 박막을 증착합니다.
Yield Improvement and Process Control
Innovative solutions to overcome challenges of emerging advanced packaging applications, such as wafer bevel management for wafer-to-wafer bonding yield improvement and high- throughput process control capability with mass metrology
CORONUS 제품군
Advanced Packaging Plasma Bevel Etch and Deposition
Coronus 시스템은 웨이퍼 베벨 엣지에 중점을 두어 전반적인 수율을 높입니다. 반도체 공정 진행 시 웨이퍼 가장자리를 따라 잔여물과 거칠기가 누적됩니다. 이는 웨이퍼의 다른 영역으로 떨어져 날리면 장치의 고장을 유발하는 결함을 발생시킬 수 있습니다. Coronus 식각 제품은 웨이퍼 베벨에 있는 잔여물을 제거하고 Coronus 증착 제품은 웨이퍼 베벨이 손상되지 않도록 보호합니다.
METRYX 제품군
Mass Metrology
램리서치의 질량 계측 시스템에는 3차원 소자 구조의 첨단 공정 모니터링과 제어에 필요한 밀리그램 미만 단위의 측정 기능이 있습니다.
Panel Processing Solutions
Transferring wafer-level processing technology, performance, and production yield, to panel-level processing. Delivering differentiated solutions for wet panel processing, such as Cu RDL, micro-bump, TGV and Cu build-up electroplating, PR/PI strip/develop, etch, roughening, and clean.
Phoenix 제품군
Electrochemical Deposition (ECD) PR-Development PR-Strip Wet Clean/Strip/Etch
Phoenix는 510x510mm 기판의 완전 자동화된 대량 패널 처리를 제공합니다.
Kallisto 제품군
Electrochemical Deposition (ECD)
300x300mm에서 1100x1100mm(5.1세대)까지 기판의 습식 화학 처리를 위한 첨단 수직 공정 플랫폼으로 반도체 업계의 요구 사항에 맞게 제작되었습니다.
Additional Resources
-
Lam Research Introduces VECTOR TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking
September 9, 2025 -
Everything You Need to Know About VECTOR TEOS 3D
September 9, 2025