DRIVING BREAKTHROUGHS WITH ADVANCED DIELECTRIC GAPFILL TECHNOLOGY
The new Striker® FE enhanced atomic layer deposition platform addresses semiconductor manufacturing challenges for 3D NAND, DRAM, and Logic chipmakers.
Today’s chips are pushing the limits of traditional scaling
Manufacturing them requires pushing the boundaries of physics and chemistry. By engineering at the atomic level, we are helping to solve our customers’ most complex challenges.
Collaboration is key to architecting the future
Success requires innovative thinking and collaboration. We work closely with customers, suppliers, and across the ecosystem to deliver the chipmaking solutions needed for today and tomorrow.