DRIVING BREAKTHROUGHS WITH ADVANCED DIELECTRIC GAPFILL TECHNOLOGY


The new Striker® FE enhanced atomic layer deposition platform addresses semiconductor manufacturing challenges for 3D NAND, DRAM, and Logic chipmakers.

Today’s chips are pushing the limits of traditional scaling


Manufacturing them requires pushing the boundaries of physics and chemistry. By engineering at the atomic level, we are helping to solve our customers’ most complex challenges.

 

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Collaboration is key to architecting the future


Success requires innovative thinking and collaboration. We work closely with customers, suppliers, and across the ecosystem to deliver the chipmaking solutions needed for today and tomorrow.


Latest News & Events

Newsroom

Silicon Snack: Software Update – Installing Smart Tech in Cities

Sep 28, 2020 Blog

Lam Announces New Atomic Layer Deposition Platform Featuring ICEFill Technology

Sep 21, 2020 Blog

LAM RESEARCH INTRODUCES ADVANCED DIELECTRIC GAPFILL TECHNOLOGY TO ENABLE NEXT-GENERATION DEVICES

Sep 21, 2020 Press Release

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