ETCH PRODUCTS

CREATING FEATURES WITH ATOMIC PRECISION

Etch processes help create chip features by selectively removing both dielectric (insulating) and metal (conducting) materials that have been added during deposition. These processes involve fabricating increasingly small, complex, and tall and narrow features using many types of materials. The primary technology, reactive ion etch (RIE), bombards the wafer surface with ions (charged particles) to remove material. For the tiniest features, atomic layer etching (ALE) removes a few atomic layers of material at a time. While conductor etch processes precisely shape critical electrical components like transistors, dielectric etch forms the insulating structures that protect conducting parts. Etch processes also create the tall, column-like features used, for example, in TSVs that link chips together and in micro-electromechanical systems (MEMS).

Lam’s plasma etch systems deliver the high-performance, high-productivity capabilities needed to form exacting structures – whether tall and narrow, short and wide, or measured in only a few nanometers.



ETCH

Our Products

DSiE Product Family

Deep Reactive Ion Etch (DRIE)

These products deliver exceptional process control at high productivity for several critical and non-critical deep silicon etch applications.

Flex Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)

Lam’s dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

Kiyo Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)

Lam’s market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.

Reliant Etch Products

Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE) Reliant Systems

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for conductor, dielectric, and metal etch applications.

Syndion Product Family

Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE)

For deep etch applications, this product family provides the exceptional across-wafer uniformity control needed for critical high aspect ratio features.

Versys Metal Product Family

Reactive Ion Etch (RIE)

These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.


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