Etch Products

Creating features with atomic precision

Etch processes help create chip features by selectively removing films and materials that have been deposited on the wafer. These processes involve fabricating increasingly small and complex features with complicated combinations of materials that need to be removed. The primary technology, reactive ion etch (RIE), activates the wafer surface with ions (charged particles) to remove material. Advanced etch techniques, such as atomic layer etching (ALE) are capable of removing a few atomic layers of material at a time. While conductor etch processes precisely shape electrically active components like transistors, dielectric etch forms the insulating structures that protect conducting parts. Etch processes also create the tall, high-aspect ratio features, such as through-silicon vias (TSVs), that allow packaging of chips together and for micro-electromechanical systems (MEMS).

Our plasma etch systems deliver the high-performance, high-productivity capabilities needed to form exacting structures – whether tall and narrow, short and wide, or measured in only a few angstroms.



Etch

Our Products

DSiE Product Family

Deep Reactive Ion Etch (DRIE)

These products deliver exceptional process control at high productivity for several critical and non-critical deep silicon etch applications.

Flex Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)

Our dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

Kiyo Product Family

Reactive Ion Etch (RIE)

These market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.

Reliant Etch Products

Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE) Reliant Systems

The refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for conductor, dielectric, and metal etch applications.

Selective Etch Product Family

Selective Etch

Breakthrough portfolio delivers isotropic material removal with angstrom-scale precision and ultra-high selectivity capabilities for 3D architectures and advanced logic and foundry applications.

Sense.i Product Family

Atomic Layer Etch (ALE) Deep Reactive Ion Etch (DRIE)

Our latest etch platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity.

Syndion Product Family

Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE)

For deep etch applications, this product family provides the exceptional across-wafer uniformity control needed for critical high aspect ratio features.

Vantex Product Family

Reactive Ion Etch (RIE)

Designed for the Sense.i platform, Vantex redefines high aspect ratio etching with innovations in technology and Equipment Intelligence.

Versys Metal Product Family

Reactive Ion Etch (RIE)

These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.


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