As the semiconductor industry continues to drive device performance and cost scaling, there is an ever-growing need for innovation in device process capability and extendibility. Device roadmaps depend on critical device features, often in 3D, and drive the need to etch smaller features, new materials, and new transistor structures on the wafer. In addition, the ability to etch multi-layer film stacks, often with extreme selectivity from one film to another, while creating optimal etched profiles at increasingly higher aspect ratios will be required.
The technical challenges of the devices require innovation in high volume manufacturing as well. As etch process times increase, the need to optimize the factory output is growing. Smarter and denser tools are required to enable the industry to transform their manufacturing practices and to adopt standards that increase efficiency and output.