The interconnect makes up the intricate wiring that connects the billions of individual components (transistors, capacitors, etc.) on a chip. As smaller and smaller devices are packed closer together, more interconnect levels are needed, and connecting everything becomes increasingly challenging. In fact, as the shrinking of feature dimensions has continued, interconnects are now becoming the speed bottleneck in today’s most advanced chips. As a result, techniques that minimize resistance of the metal connections and novel dielectric materials that boost insulating capacity are needed. To produce the latest high-performance electronic devices, advanced interconnect structures involve narrow geometries and complex film layers, which require increasingly flexible and precise process capabilities.
Interconnect
Our Solutions
ALTUS Product Family
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD)
Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.
Coronus Product Family
Plasma Bevel Clean
These bevel clean systems remove unwanted materials from the wafer’s edge while protecting the active die area to enhance die yield.
Coventor Product Family
MEMS/IoT Design Automation Semiconductor Process Modeling
Our semiconductor process modeling software (SEMulator3D) performs predictive modeling of etch, deposition & other processes, to identify problems prior to fabrication.
DV-Prime & Da Vinci Product Families
Wet Clean/Strip/Etch
These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.
EOS Product Family
Wet Clean/Etch
Our advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.
Flex Product Family
Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)
Our dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.
GAMMA Product Family
Dry Strip
These products provide the process flexibility needed to address a wide range of critical photoresist strip applications.
Kiyo Product Family
Reactive Ion Etch (RIE)
These market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.
Metryx Product Family
Mass Metrology
Our mass metrology systems deliver sub-milligram measurement capability for advanced process monitoring and control of three-dimensional device structures.
Reliant Clean Products
Reliant Systems Wet Clean/Strip/Etch
Our refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for a range of frontside and backside/bevel cleans.
Reliant Deposition Products
Chemical Vapor Deposition (CVD) High-Density Plasma Chemical Vapor Deposition (HDP-CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Reliant Systems
The refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for dielectric film applications.
Reliant Etch Products
Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE) Reliant Systems
The refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for conductor, dielectric, and metal etch applications.
SABRE Product Family
Electrochemical Deposition (ECD)
This product family offers precision metal plating for copper damascene manufacturing on the industry’s productivity-leading ECD platform.
Selective Etch Product Family
Selective Etch
Breakthrough portfolio delivers isotropic material removal with angstrom-scale precision and ultra-high selectivity capabilities for 3D architectures and advanced logic and foundry applications.
Sense.i Product Family
Atomic Layer Etch (ALE) Deep Reactive Ion Etch (DRIE)
Our latest etch platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity.
SOLA Product Family
Ultraviolet Thermal Processing (UVTP)
This product family offers specialized post-deposition film treatments to improve physical characteristics for advanced film applications.
SPEED Product Family
High-Density Plasma Chemical Vapor Deposition (HDP-CVD)
These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.
Syndion Product Family
Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE)
For deep etch applications, this product family provides the exceptional across-wafer uniformity control needed for critical high aspect ratio features.
VECTOR Product Family
Plasma-Enhanced Chemical Vapor Deposition (PECVD)
Our PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.
Versys Metal Product Family
Reactive Ion Etch (RIE)
These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.
Related Blog Posts
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Tech Brief: An Introduction to Interconnects
SEPTEMBER 25, 2017We often hear that advanced chips contain billions of transistors – an incredible, mind-blowing fact to be sure – but did you know that large-scale integrated chips (that are the size of a fingernail) can contain ~30 miles of interconnect “wires” in stacked levels?
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Perspectives on Advanced Interconnect Developments
JUNE 20, 2016Industry experts came together recently to discuss some of the critical challenges facing interconnect scaling. As the number of transistors on advanced chips continues to increase, fabricating the tiny wires that connect them becomes more complex, raising several questions. How will we fabricate these dense, complicated interconnects?