Interconnect Solutions

Lam Research Our Solutions Copper Interconnect

The interconnect makes up the intricate wiring that connects the billions of individual components (transistors, capacitors, etc.) on a chip. As smaller and smaller devices are packed closer together, more interconnect levels are needed, and connecting everything becomes increasingly challenging. In fact, as the shrinking of feature dimensions has continued, interconnects are now becoming the speed bottleneck in today’s most advanced chips. As a result, techniques that minimize resistance of the metal connections and novel dielectric materials that boost insulating capacity are needed. To produce the latest high-performance electronic devices, advanced interconnect structures involve narrow geometries and complex film layers, which require increasingly flexible and precise process capabilities.



Interconnect

Our Solutions

ALTUS Product Family

Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD)

Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.

Coronus Product Family

Plasma Bevel Clean

These bevel clean systems remove unwanted materials from the wafer’s edge while protecting the active die area to enhance die yield.

DV-Prime & Da Vinci Product Families

Wet Clean/Strip/Etch

These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.

EOS Product Family

Wet Clean/Strip/Etch

Lam’s advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.

Flex Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)

Lam’s dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

GAMMA Product Family

Dry Strip

These products provide the process flexibility needed to address a wide range of critical photoresist strip applications.

Kiyo Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)

Lam’s market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.

Metryx Product Family

Mass Metrology

Lam’s mass metrology systems deliver sub-milligram measurement capability for advanced process monitoring and control of three-dimensional device structures.

Reliant Clean Products

Reliant Systems Wet Clean/Strip/Etch

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for a range of frontside and backside/bevel cleans.

Reliant Deposition Products

Chemical Vapor Deposition (CVD) High-Density Plasma Chemical Vapor Deposition (HDP-CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Reliant Systems

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for dielectric film applications.

Reliant Etch Products

Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE) Reliant Systems

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for conductor, dielectric, and metal etch applications.

SABRE Product Family

Electrochemical Deposition (ECD)

This product family offers precision metal plating for copper damascene manufacturing on the industry’s productivity-leading ECD platform.

SOLA Product Family

Ultraviolet Thermal Processing (UVTP)

This product family offers specialized post-deposition film treatments to improve physical characteristics for advanced film applications.

SPEED Product Family

High-Density Plasma Chemical Vapor Deposition (HDP-CVD)

These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.

Syndion Product Family

Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE)

For deep etch applications, this product family provides the exceptional across-wafer uniformity control needed for critical high aspect ratio features.

VECTOR Product Family

Plasma-Enhanced Chemical Vapor Deposition (PECVD)

Lam’s PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.

Versys Metal Product Family

Reactive Ion Etch (RIE)

These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.


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