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Interconnect Solutions

Interconnect

The interconnect makes up the intricate wiring that connects the billions of individual components (transistors, capacitors, etc.) on a chip. As smaller and smaller devices are packed closer together, more interconnect levels are needed, and connecting everything becomes increasingly challenging. In fact, as the shrinking of feature dimensions has continued, interconnects are now becoming the speed bottleneck in today’s most advanced chips. As a result, techniques that minimize resistance of the metal connections and novel dielectric materials that boost insulating capacity are needed. To produce the latest high-performance electronic devices, advanced interconnect structures involve narrow geometries and complex film layers, which require increasingly flexible and precise process capabilities.


Interconnect

Our Solutions

ALTUS Product Family

Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD)

Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.

Coronus Product Family

Plasma Bevel Etch and Deposition

Coronus systems focus on the bevel edge to enhance overall yield. Semiconductor processing can cause residues and roughness to accumulate along the wafer edge where they may flake off, drift to other areas, and create defects that cause a device to fail. Coronus etch products remove bevel residues and Coronus deposition protect the wafer bevel from damage.

Coventor Product Family

Plasma Modeling Semiconductor Process Modeling

Our semiconductor process modeling software (SEMulator3D) and plasma modeling software (OverViz) perform predictive modeling of etch, deposition, plasma & other processes, to identify problems prior to fabrication.

DV-Prime & Da Vinci Product Families

Wet Clean/Strip/Etch

These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.

EOS Product Family

Wet Clean/Etch

Our advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.

Flex Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)

Our dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

GAMMA Product Family

Dry Strip

These products provide the process flexibility needed to address a wide range of critical photoresist strip applications.

Kiyo Product Family

Reactive Ion Etch (RIE)

These market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.

Metior Product Family

Mass Metrology

Our mass metrology systems deliver sub-milligram measurement capability for advanced process monitoring and control of three-dimensional device structures.

OverViz

Plasma Modeling

OverViz™ is an industrial simulation software platform for high-fidelity modeling of plasma discharges.

Reliant Clean Products

Reliant Systems Wet Clean/Strip/Etch

Our Reliant clean products enable roadmaps for Specialty Technologies and extend the productive life of fabs.

Reliant Deposition Products

Chemical Vapor Deposition (CVD) High-Density Plasma Chemical Vapor Deposition (HDP-CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Pulsed Laser Deposition (PLD) Reliant Systems

Our Reliant deposition products enable roadmaps for Specialty Technologies and extend the productive life of fabs.

Reliant Etch Products

Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE) Reliant Systems

Our Reliant etch products enable roadmaps for Specialty Technologies and extend the productive life of fabs.

SABRE Product Family

Electrochemical Deposition (ECD)

This product family offers precision metal plating for copper damascene manufacturing on the industry’s productivity-leading ECD platform.

Selective Etch Product Family

Selective Etch

Breakthrough portfolio delivers isotropic material removal with angstrom-scale precision and ultra-high selectivity capabilities for 3D architectures and advanced logic and foundry applications.

SEMulator3D

Semiconductor Process Modeling

SEMulator3D® is a semiconductor process modeling platform that offers wide ranging technology development capabilities.

Sense.i Product Family

Atomic Layer Etch (ALE) Deep Reactive Ion Etch (DRIE)

Our latest etch platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity.

SOLA Product Family

Ultraviolet Thermal Processing (UVTP)

This product family offers specialized post-deposition film treatments to improve physical characteristics for advanced film applications.

SPEED Product Family

High-Density Plasma Chemical Vapor Deposition (HDP-CVD)

These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.

Syndion Product Family

Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE)

For deep etch applications, this product family provides the exceptional across-wafer uniformity control needed for critical high aspect ratio features.

VECTOR Product Family

Plasma-Enhanced Chemical Vapor Deposition (PECVD)

Our PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.

Versys Metal Product Family

Reactive Ion Etch (RIE)

These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.

Related Blog Posts

  • Tech Brief: An Introduction to Interconnects

    SEPTEMBER 25, 2017

    We often hear that advanced chips contain billions of transistors – an incredible, mind-blowing fact to be sure – but did you know that large-scale integrated chips (that are the size of a fingernail) can contain ~30 miles of interconnect “wires” in stacked levels?

  • Perspectives on Advanced Interconnect Developments

    JUNE 20, 2016

    Industry experts came together recently to discuss some of the critical challenges facing interconnect scaling. As the number of transistors on advanced chips continues to increase, fabricating the tiny wires that connect them becomes more complex, raising several questions. How will we fabricate these dense, complicated interconnects?

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