EOS Product Family

Wafer cleaning is a critical function that must be repeated many times during semiconductor manufacturing. As device geometries shrink below 10 nm and new materials are introduced, the number of cleaning steps continues to grow at an aggressive rate. Increasingly complicated cleaning processes are driving longer process times and the need for greater overall productivity. Advanced cleaning capabilities are needed to address additional technical challenges. For example, multiple patterning approaches require collapse-free drying and damage-free particle removal. Cleaning processes that tightly control material loss are critical for FinFET. Wafer backside film removal is needed to modulate wafer bow and stress in 3D NAND structures.