Advanced Memory Solutions

Memory cells – the chip components that store electronic data – include short-term volatile (such as DRAM) and long-term non-volatile (such as flash) storage types. DRAM is the mainstay for “working” (active) memory, while flash memory is used to store large amounts of data in a compact form. To increase device density for more storage capacity, DRAM features continue to shrink, and NAND flash has moved to 3D architectures, which raise additional processing challenges. For example, the numerous layers in 3D NAND are vulnerable to stress, and any imperfections in the high aspect-ratio channels can create electrical shorts and interference. Production of newer memory types that bridge the gap between active and storage classes is also difficult due to the use of novel, hard-to-process materials. As a result, exceptional process control, flexibility, and productivity are needed.



Advanced Memory

Our Solutions

ALTUS Product Family

Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD)

Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.

Coronus Product Family

Plasma Bevel Clean

These bevel clean systems remove unwanted materials from the wafer’s edge while protecting the active die area to enhance die yield.

EOS Product Family

Wet Clean/Strip/Etch

Lam’s advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.

Flex Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)

Lam’s dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

GAMMA Product Family

Dry Strip

These products provide the process flexibility needed to address a wide range of critical photoresist strip applications.

Kiyo Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)

Lam’s market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.

Metryx Product Family

Mass Metrology

Lam’s mass metrology systems deliver sub-milligram measurement capability for advanced process monitoring and control of three-dimensional device structures.

Reliant Deposition Products

Chemical Vapor Deposition (CVD) High-Density Plasma Chemical Vapor Deposition (HDP-CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Reliant Systems

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for dielectric film applications.

Reliant Etch Products

Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE) Reliant Systems

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for conductor, dielectric, and metal etch applications.

SABRE Product Family

Electrochemical Deposition (ECD)

This product family offers precision metal plating for copper damascene manufacturing on the industry’s productivity-leading ECD platform.

SPEED Product Family

High-Density Plasma Chemical Vapor Deposition (HDP-CVD)

These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.

Striker Product Family

Atomic Layer Deposition (ALD)

Using advanced ALD technology, these products deliver dielectric films with exceptional control for critical processes in advanced devices with nanoscale features.

VECTOR Product Family

Plasma-Enhanced Chemical Vapor Deposition (PECVD)

Lam’s PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.

Versys Metal Product Family

Reactive Ion Etch (RIE)

These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.


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