Memory cells – the chip components that store electronic data – include short-term volatile (such as DRAM) and long-term non-volatile (such as flash) storage types. DRAM is the mainstay for “working” (active) memory, while flash memory is used to store large amounts of data in a compact form. To increase device density for more storage capacity, DRAM features continue to shrink, and NAND flash has moved to 3D architectures, which raise additional processing challenges. For example, the numerous layers in 3D NAND are vulnerable to stress, and any imperfections in the high aspect-ratio channels can create electrical shorts and interference. Production of newer memory types that bridge the gap between active and storage classes is also difficult due to the use of novel, hard-to-process materials. As a result, exceptional process control, flexibility, and productivity are needed.
Advanced Memory
Our Solutions
ALTUS Product Family
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD)
Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.
Coronus Product Family
Plasma Bevel Etch and Deposition
Coronus systems focus on the bevel edge to enhance overall yield. Semiconductor processing can cause residues and roughness to accumulate along the wafer edge where they may flake off, drift to other areas, and create defects that cause a device to fail. Coronus etch products remove bevel residues and Coronus deposition protect the wafer bevel from damage.
Coventor Product Family
MEMS/IoT Design Automation Semiconductor Process Modeling
Our semiconductor process modeling software (SEMulator3D) performs predictive modeling of etch, deposition & other processes, to identify problems prior to fabrication.
EOS Product Family
Wet Clean/Etch
Our advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.
Flex Product Family
Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)
Our dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.
Galaxy Product Family
Wet Clean/Strip/Etch
The Galaxy platform combines years of experience in batch wafer processing with advanced process control typically only found on single wafer tools.
GAMMA Product Family
Dry Strip
These products provide the process flexibility needed to address a wide range of critical photoresist strip applications.
Kallisto Product Family
Dielectric Developement Electrochemical Deposition (ECD) PR-Development PR-Strip Wet Clean/Strip/Etch
An advanced vertical processing platform for wet chemical treatment of substrates from 300x300mm up to Gen 5.1 (1100 x 1300mm) tailored to the needs of semi industry.
Kiyo Product Family
Reactive Ion Etch (RIE)
These market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.
Metior Product Family
Mass Metrology
Our mass metrology systems deliver sub-milligram measurement capability for advanced process monitoring and control of three-dimensional device structures.
OverViz
Plasma Modeling
OverViz™ is an industrial simulation software platform for high-fidelity modeling of plasma discharges.
Phoenix Product Family
Dielectric Developement Electrochemical Deposition (ECD) PR-Development PR-Strip Wet Clean/Strip/Etch
Phoenix offers a fully-automated high volume panel processing for 510x515mm substrates.
Reliant Deposition Products
Chemical Vapor Deposition (CVD) High-Density Plasma Chemical Vapor Deposition (HDP-CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Pulsed Laser Deposition (PLD) Reliant Systems
Our Reliant deposition products enable roadmaps for Specialty Technologies and extend the productive life of fabs.
Reliant Etch Products
Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE) Reliant Systems
Our Reliant etch products enable roadmaps for Specialty Technologies and extend the productive life of fabs.
SABRE Product Family
Electrochemical Deposition (ECD)
This product family offers precision metal plating for copper damascene manufacturing on the industry’s productivity-leading ECD platform.
Selective Etch Product Family
Selective Etch
Breakthrough portfolio delivers isotropic material removal with angstrom-scale precision and ultra-high selectivity capabilities for 3D architectures and advanced logic and foundry applications.
SEMulator3D
Semiconductor Process Modeling
SEMulator3D® is a semiconductor process modeling platform that offers wide ranging technology development capabilities.
Sense.i Product Family
Atomic Layer Etch (ALE) Deep Reactive Ion Etch (DRIE)
Our latest etch platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity.
SPEED Product Family
High-Density Plasma Chemical Vapor Deposition (HDP-CVD)
These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.
Striker Product Family
Atomic Layer Deposition (ALD)
Using advanced ALD technology, these products deliver dielectric films with exceptional control for critical processes in advanced devices with nanoscale features.
Triton Product Family
Electrochemical Deposition (ECD) Wet Clean/Strip/Etch
The Triton platform is a versatile and modular solution for single wafer plating and wet processing.
Vantex Product Family
Reactive Ion Etch (RIE)
Designed for the Sense.i platform, Vantex redefines high aspect ratio etching with innovations in technology and Equipment Intelligence.
VECTOR Product Family
Plasma-Enhanced Chemical Vapor Deposition (PECVD)
Our PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.
Versys Metal Product Family
Reactive Ion Etch (RIE)
These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.
Related Blog Posts
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Tech Brief: ABCs of New Memory
APRIL 16, 2018From PCRAM and MRAM to RRAM and more, there’s a whole new alphabet soup of memory technologies making their way to the fab. Fueling this development are technology advances in gaming and mobile products and the growth of cloud computing – important applications that are stretching the capabilities of today’s mainstream memory technologies.
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ALD Tungsten Solves Capacity Challenges in 3D NAND Device Manufacturing
JANUARY 22, 2019Our increasingly connected and ever “smarter” world generates increasing amounts of data, putting pressure on manufacturers who face new technical challenges in delivering the increasing capacity required for processing and storage. The ALD Tungsten process is helping 3D NAND manufacturers overcome the technical challenges of producing memory chips with higher storage capacity.