Memory cells – the chip components that store electronic data – include short-term volatile (such as DRAM) and long-term non-volatile (such as flash) storage types. DRAM is the mainstay for “working” (active) memory, while flash memory is used to store large amounts of data in a compact form. To increase device density for more storage capacity, DRAM features continue to shrink, and NAND flash has moved to 3D architectures, which raise additional processing challenges. For example, the numerous layers in 3D NAND are vulnerable to stress, and any imperfections in the high aspect-ratio channels can create electrical shorts and interference. Production of newer memory types that bridge the gap between active and storage classes is also difficult due to the use of novel, hard-to-process materials. As a result, exceptional process control, flexibility, and productivity are needed.
Advanced Memory
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Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.
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Our semiconductor process modeling software (SEMulator3D) performs predictive modeling of etch, deposition & other processes, to identify problems prior to fabrication.
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Our advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.
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Our dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.
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These products provide the process flexibility needed to address a wide range of critical photoresist strip applications.
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These market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.
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Our mass metrology systems deliver sub-milligram measurement capability for advanced process monitoring and control of three-dimensional device structures.
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The refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for dielectric film applications.
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The refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for conductor, dielectric, and metal etch applications.
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Breakthrough portfolio delivers isotropic material removal with angstrom-scale precision and ultra-high selectivity capabilities for 3D architectures and advanced logic and foundry applications.
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Our latest etch platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity.
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High-Density Plasma Chemical Vapor Deposition (HDP-CVD)
These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.
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Atomic Layer Deposition (ALD)
Using advanced ALD technology, these products deliver dielectric films with exceptional control for critical processes in advanced devices with nanoscale features.
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Reactive Ion Etch (RIE)
Designed for the Sense.i platform, Vantex redefines high aspect ratio etching with innovations in technology and Equipment Intelligence.
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Plasma-Enhanced Chemical Vapor Deposition (PECVD)
Our PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.
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Reactive Ion Etch (RIE)
These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.
Related Blog Posts
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Tech Brief: ABCs of New Memory
APRIL 16, 2018From PCRAM and MRAM to RRAM and more, there’s a whole new alphabet soup of memory technologies making their way to the fab. Fueling this development are technology advances in gaming and mobile products and the growth of cloud computing – important applications that are stretching the capabilities of today’s mainstream memory technologies.
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ALD Tungsten Solves Capacity Challenges in 3D NAND Device Manufacturing
JANUARY 22, 2019Our increasingly connected and ever “smarter” world generates increasing amounts of data, putting pressure on manufacturers who face new technical challenges in delivering the increasing capacity required for processing and storage. The ALD Tungsten process is helping 3D NAND manufacturers overcome the technical challenges of producing memory chips with higher storage capacity.