Bevel cleaning removes unwanted masks, residues, and films from the edge of a wafer between manufacturing steps. If not cleaned, these materials become defect sources. For instance, they can flake off and re-deposit on the device area during subsequent processes. Even a single particle that lands on a critical part of a device can ruin the entire chip. By inserting bevel clean processes at strategic points, these potential defect sources can be eliminated and more good chips produced.
By combining the precise control and flexibility of plasma with technology that protects the active die area, Lam’s Coronus® bevel clean family cleans the wafer’s edge to enhance die yield.