Patterning Solutions


Patterning involves the set of process steps – including lithography, deposition, and etch – that create the extremely small, intricate features of an integrated circuit. With each new generation, device dimensions continue to shrink. For advanced structures, these feature sizes can be too small and/or packed too closely together for conventional lithography, the step that transfers the chip design’s intricate detail from the mask “template” onto the wafer. To compensate, chipmakers are using advanced techniques like double/quadruple and spacer-based patterning, involving multiple masks and process sets. Even as these approaches ease lithography limitations, they create new demands for exceptional process precision and film quality in order to accurately produce the fine, dense features required.


Our Solutions
Coronus Product Family

Plasma Bevel Clean

These bevel clean systems remove unwanted materials from the wafer’s edge while protecting the active die area to enhance die yield.

Coventor Product Family

MEMS/IoT Design Automation Semiconductor Process Modeling

Our semiconductor process modeling software (SEMulator3D) performs predictive modeling of etch, deposition & other processes, to identify problems prior to fabrication.

DV-Prime & Da Vinci Product Families

Wet Clean/Strip/Etch

These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.

EOS Product Family

Wet Clean/Etch

Our advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.

Flex Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)

Our dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

GAMMA Product Family

Dry Strip

These products provide the process flexibility needed to address a wide range of critical photoresist strip applications.

Kiyo Product Family

Reactive Ion Etch (RIE)

These market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.

Metryx Product Family

Mass Metrology

Our mass metrology systems deliver sub-milligram measurement capability for advanced process monitoring and control of three-dimensional device structures.

Reliant Clean Products

Reliant Systems Wet Clean/Strip/Etch

Our refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for a range of frontside and backside/bevel cleans.

Reliant Deposition Products

Chemical Vapor Deposition (CVD) High-Density Plasma Chemical Vapor Deposition (HDP-CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Reliant Systems

The refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for dielectric film applications.

Reliant Etch Products

Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE) Reliant Systems

The refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for conductor, dielectric, and metal etch applications.

Selective Etch Product Family

Selective Etch

Breakthrough portfolio delivers isotropic material removal with angstrom-scale precision and ultra-high selectivity capabilities for 3D architectures and advanced logic and foundry applications.

Sense.i Product Family

Atomic Layer Etch (ALE) Deep Reactive Ion Etch (DRIE)

Our latest etch platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity.

Striker Product Family

Atomic Layer Deposition (ALD)

Using advanced ALD technology, these products deliver dielectric films with exceptional control for critical processes in advanced devices with nanoscale features.

VECTOR Product Family

Plasma-Enhanced Chemical Vapor Deposition (PECVD)

Our PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.

Versys Metal Product Family

Reactive Ion Etch (RIE)

These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.

Related Blog Posts

  • Tech Brief: Multiple Patterning Makes Miniaturization Possible

    MARCH 23, 2015

    Have you ever wondered how everyday electronics, like smartphones and tablets, pack so much functionality into such relatively small and lightweight packages? If so, here’s your chance to learn a bit more about one of the key technologies behind making these complex devices so compact – multiple patterning – which was also one of the hot topics at the recent SPIE Advanced Lithography Symposium.

  • Continued Scaling with Multiple Patterning

    NOVEMBER 28, 2016

    Did you know that different patterns require different types of multiple patterning? Today’s advanced chips are more complex than ever before, with transistors and other structures that are smaller and more densely packed. To create those tiny features, chipmakers have developed multiple multiple patterning strategies that enable much finer dimensions than current lithography can achieve.