Patterning Solutions

Lam Research Multiple Patterning

Patterning involves the set of process steps – including lithography, deposition, and etch – that create the extremely small, intricate features of an integrated circuit. With each new generation, device dimensions continue to shrink. For advanced structures, these feature sizes can be too small and/or packed too closely together for conventional lithography, the step that transfers the chip design’s intricate detail from the mask “template” onto the wafer. To compensate, chipmakers are using advanced techniques like double/quadruple and spacer-based patterning, involving multiple masks and process sets. Even as these approaches ease lithography limitations, they create new demands for exceptional process precision and film quality in order to accurately produce the fine, dense features required.



Patterning

Our Solutions

Coronus Product Family

Plasma Bevel Clean

These bevel clean systems remove unwanted materials from the wafer’s edge while protecting the active die area to enhance die yield.

DV-Prime & Da Vinci Product Families

Wet Clean/Strip/Etch

These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.

EOS Product Family

Wet Clean/Strip/Etch

Lam’s advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.

Flex Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)

Lam’s dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

GAMMA Product Family

Dry Strip

These products provide the process flexibility needed to address a wide range of critical photoresist strip applications.

Kiyo Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)

Lam’s market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.

Metryx Product Family

Mass Metrology

Lam’s mass metrology systems deliver sub-milligram measurement capability for advanced process monitoring and control of three-dimensional device structures.

Reliant Clean Products

Reliant Systems Wet Clean/Strip/Etch

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for a range of frontside and backside/bevel cleans.

Reliant Deposition Products

Chemical Vapor Deposition (CVD) High-Density Plasma Chemical Vapor Deposition (HDP-CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Reliant Systems

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for dielectric film applications.

Reliant Etch Products

Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE) Reliant Systems

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for conductor, dielectric, and metal etch applications.

Striker Product Family

Atomic Layer Deposition (ALD)

Using advanced ALD technology, these products deliver dielectric films with exceptional control for critical processes in advanced devices with nanoscale features.

VECTOR Product Family

Plasma-Enhanced Chemical Vapor Deposition (PECVD)

Lam’s PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.

Versys Metal Product Family

Reactive Ion Etch (RIE)

These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.


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