Patterning involves the set of process steps – including lithography, deposition, and etch – that create the extremely small, intricate features of an integrated circuit. With each new generation, device dimensions continue to shrink. For advanced structures, these feature sizes can be too small and/or packed too closely together for conventional lithography, the step that transfers the chip design’s intricate detail from the mask “template” onto the wafer. To compensate, chipmakers are using advanced techniques like double/quadruple and spacer-based patterning, involving multiple masks and process sets. Even as these approaches ease lithography limitations, they create new demands for exceptional process precision and film quality in order to accurately produce the fine, dense features required.
Patterning
Our Solutions
Coronus Product Family
Plasma Bevel Etch and Deposition
Coronus systems focus on the bevel edge to enhance overall yield. Semiconductor processing can cause residues and roughness to accumulate along the wafer edge where they may flake off, drift to other areas, and create defects that cause a device to fail. Coronus etch products remove bevel residues and Coronus deposition protect the wafer bevel from damage.
Coventor Product Family
MEMS/IoT Design Automation Semiconductor Process Modeling
Our semiconductor process modeling software (SEMulator3D) performs predictive modeling of etch, deposition & other processes, to identify problems prior to fabrication.
DV-Prime & Da Vinci Product Families
Wet Clean/Strip/Etch
These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.
EOS Product Family
Wet Clean/Etch
Our advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.
Flex Product Family
Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)
Our dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.
GAMMA Product Family
Dry Strip
These products provide the process flexibility needed to address a wide range of critical photoresist strip applications.
Kiyo Product Family
Reactive Ion Etch (RIE)
These market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.
Metryx Product Family
Mass Metrology
Our mass metrology systems deliver sub-milligram measurement capability for advanced process monitoring and control of three-dimensional device structures.
Reliant Clean Products
Reliant Systems Wet Clean/Strip/Etch
Our Reliant clean products enable roadmaps for Specialty Technologies and extend the productive life of fabs.
Reliant Deposition Products
Chemical Vapor Deposition (CVD) High-Density Plasma Chemical Vapor Deposition (HDP-CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Pulsed Laser Deposition (PLD) Reliant Systems
Our Reliant deposition products enable roadmaps for Specialty Technologies and extend the productive life of fabs.
Reliant Etch Products
Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE) Reliant Systems
Our Reliant etch products enable roadmaps for Specialty Technologies and extend the productive life of fabs.
Selective Etch Product Family
Selective Etch
Breakthrough portfolio delivers isotropic material removal with angstrom-scale precision and ultra-high selectivity capabilities for 3D architectures and advanced logic and foundry applications.
Sense.i Product Family
Atomic Layer Etch (ALE) Deep Reactive Ion Etch (DRIE)
Our latest etch platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity.
Striker Product Family
Atomic Layer Deposition (ALD)
Using advanced ALD technology, these products deliver dielectric films with exceptional control for critical processes in advanced devices with nanoscale features.
VECTOR Product Family
Plasma-Enhanced Chemical Vapor Deposition (PECVD)
Our PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.
Versys Metal Product Family
Reactive Ion Etch (RIE)
These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.
Related Blog Posts
-
Tech Brief: Multiple Patterning Makes Miniaturization Possible
MARCH 23, 2015Have you ever wondered how everyday electronics, like smartphones and tablets, pack so much functionality into such relatively small and lightweight packages? If so, here’s your chance to learn a bit more about one of the key technologies behind making these complex devices so compact – multiple patterning – which was also one of the hot topics at the recent SPIE Advanced Lithography Symposium.
-
Continued Scaling with Multiple Patterning
NOVEMBER 28, 2016Did you know that different patterns require different types of multiple patterning? Today’s advanced chips are more complex than ever before, with transistors and other structures that are smaller and more densely packed. To create those tiny features, chipmakers have developed multiple multiple patterning strategies that enable much finer dimensions than current lithography can achieve.