Patterning involves the set of process steps – including lithography, deposition, and etch – that create the extremely small, intricate features of an integrated circuit. With each new generation, device dimensions continue to shrink. For advanced structures, these feature sizes can be too small and/or packed too closely together for conventional lithography, the step that transfers the chip design’s intricate detail from the mask “template” onto the wafer. To compensate, chipmakers are using advanced techniques like double/quadruple and spacer-based patterning, involving multiple masks and process sets. Even as these approaches ease lithography limitations, they create new demands for exceptional process precision and film quality in order to accurately produce the fine, dense features required.
Patterning
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These bevel clean systems remove unwanted materials from the wafer’s edge while protecting the active die area to enhance die yield.
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These products provide the process flexibility needed to address a wide range of critical photoresist strip applications.
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These market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.
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Mass Metrology
Our mass metrology systems deliver sub-milligram measurement capability for advanced process monitoring and control of three-dimensional device structures.
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Our refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for a range of frontside and backside/bevel cleans.
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Selective Etch
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Our latest etch platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity.
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Using advanced ALD technology, these products deliver dielectric films with exceptional control for critical processes in advanced devices with nanoscale features.
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Our PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.
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Reactive Ion Etch (RIE)
These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.
Related Blog Posts
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Tech Brief: Multiple Patterning Makes Miniaturization Possible
MARCH 23, 2015Have you ever wondered how everyday electronics, like smartphones and tablets, pack so much functionality into such relatively small and lightweight packages? If so, here’s your chance to learn a bit more about one of the key technologies behind making these complex devices so compact – multiple patterning – which was also one of the hot topics at the recent SPIE Advanced Lithography Symposium.
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Continued Scaling with Multiple Patterning
NOVEMBER 28, 2016Did you know that different patterns require different types of multiple patterning? Today’s advanced chips are more complex than ever before, with transistors and other structures that are smaller and more densely packed. To create those tiny features, chipmakers have developed multiple multiple patterning strategies that enable much finer dimensions than current lithography can achieve.