Reliant Clean Products
Products
Reliant Systems Wet Clean/Strip
Advanced Packaging, Analog & Mixed Signal, Discrete & Power Devices, Interconnect, Optoelectronics & Photonics, Patterning, Sensors & Transducers, Transistor
A wide range of wafer cleaning techniques are necessary between manufacturing steps to eliminate unwanted material that could lead to defects and to prepare the wafer surface for subsequent processing. Wet processing is also used for applications like photoresist removal and silicon thinning.
Lam’s Reliant® spin wet clean products offer a comprehensive suite of proven high-productivity solutions that address front-end-of-line (FEOL), back-end-of-line (BEOL), and backside/bevel cleans.
Industry Challenges
Emergence of several markets, collectively referred to as “more than Moore,” are creating the need for additional clean steps to manage the wafer surface for continued processing. These segments – which include micro-electromechanical systems (MEMS) and sensors, products for the Internet of Things (IoT), and power devices – require efficient cleaning steps that require removal of a variety of materials. For leading-edge chips, clean processes need to be thorough, yet gentle, to minimize damage to fragile structures. Here, cost efficiency is especially important. In addition, productivity solutions are needed that improve throughput and equipment reliability and availability.
Key Customer Benefits
- Process flexibility for a wide range of materials
- Ultra-thin substrates handling for 150 mm to 300 mm wafers
- Excellent process uniformity across the wafer, wafer-to-wafer, and lot-to-lot
- Productivity enhancement for CMOS image sensors and power device silicon etching
Product Offerings
- Da Vinci® family
- SP Series family
Key Applications
- Wet clean
- Wet etch
- Wet photoresist strip
- Silicon wafer thinning