DISCRETES & POWER DEVICES SOLUTIONS

Discrete devices are single semiconductors like diodes or transistors. Power transistors are an important class of discrete devices and are used in a range of applications to regulate voltages, help lower power consumption, and reduce heat generation. For example, they are essential components in circuits aimed at extending battery life in portable electronics. Emerging wide-bandgap power devices (e.g., GaN and SiC) offer both low- and high-power applications at higher frequencies, addressing consumer electronics as well as higher-power applications in the power grid, energy, transportation, and automotive sectors. Examples of key power devices based upon silicon or wide-bandgap materials include power diodes, thyristors, power metal-oxide semiconductor field effect transistors (MOSFETs), and insulated gate bipolar transistors (IGBTs). These types of devices require low-cost manufacturing from reliable, high-productivity, and cost-effective equipment.



DISCRETES & POWER DEVICES

Our Solutions

DSiE Product Family

Deep Reactive Ion Etch (DRIE)

These products deliver exceptional process control at high productivity for several critical and non-critical deep silicon etch applications.

DV-Prime & Da Vinci Product Families

Wet Clean/Strip/Etch

These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.

Flex Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)

Lam’s dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

Kiyo Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)

Lam’s market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.

Metryx Product Family

Mass Metrology

Lam’s mass metrology systems deliver sub-milligram measurement capability for advanced process monitoring and control of three-dimensional device structures.

Reliant Clean Products

Reliant Systems Wet Clean/Strip/Etch

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for a range of frontside and backside/bevel cleans.

Reliant Deposition Products

Chemical Vapor Deposition (CVD) High-Density Plasma Chemical Vapor Deposition (HDP-CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Reliant Systems

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for dielectric film applications.

Reliant Etch Products

Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE) Reliant Systems

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for conductor, dielectric, and metal etch applications.

SP Series Product Family

Wet Clean/Strip/Etch

This proven product family delivers reliable, cost-efficient wet clean/wet etch solutions that gently remove unwanted materials from the wafer.

SPEED Product Family

High-Density Plasma Chemical Vapor Deposition (HDP-CVD)

These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.

VECTOR Product Family

Plasma-Enhanced Chemical Vapor Deposition (PECVD)

Lam’s PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.

Versys Metal Product Family

Reactive Ion Etch (RIE)

These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.

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