Used throughout chip manufacturing, deposition processes lay down a wide range of conducting and insulating materials on the wafer that help form the components and wiring of a semiconductor device. For markets such as micro-electromechanical systems (MEMS) and power devices, the numerous feature shapes and different materials involve additional manufacturing requirements.
Lam’s Reliant® deposition product family enables roadmaps for Specialty Technologies and extends the productive life of fabs.
In recent years, the semiconductor industry has expanded to new segments such as power chips, CMOS image sensors (CIS), radio frequency (RF) filters, and micro-electromechanical systems (MEMS) that enable greater connectivity, more powerful imaging, and a host of other market-driven capabilities. Because of the variety of requirements used in their manufacture, deposition technologies must be capable of addressing numerous material and performance needs.