Deposition processes create layers of dielectric (insulating) and metal (conducting) materials used to build a semiconductor device. Depending on the type of material and structure being made, different techniques are employed. Electrochemical deposition (ECD) creates the copper “wiring” (interconnect) that links devices in an integrated circuit. Metal plating of copper and other metals is also used for through-silicon vias and wafer-level packaging applications. Tiny tungsten connectors and thin barriers are made with the precision of chemical vapor deposition (CVD) and atomic layer deposition (ALD), which adds only a few layers of atoms at a time. Plasma-enhanced CVD (PECVD), high-density plasma CVD (HDP-CVD), and ALD are used to form the critical insulating layers that isolate and protect all of these electrical structures.
For the numerous materials and demanding features involved, Lam’s thin film deposition products provide the precision, performance, and flexibility needed for a wide range of challenging device applications.
ALTUS Product Family
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD)
Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.
Reliant Deposition Products
Chemical Vapor Deposition (CVD) High-Density Plasma Chemical Vapor Deposition (HDP-CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Reliant Systems
The refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for dielectric film applications.
SABRE 3D Product Family
Electrochemical Deposition (ECD)
Using our proven Electrofill technology, these high-productivity systems deliver quality metal films for advanced packaging applications.
SABRE Product Family
Electrochemical Deposition (ECD)
This product family offers precision metal plating for copper damascene manufacturing on the industry’s productivity-leading ECD platform.
SOLA Product Family
Ultraviolet Thermal Processing (UVTP)
This product family offers specialized post-deposition film treatments to improve physical characteristics for advanced film applications.
SPEED Product Family
High-Density Plasma Chemical Vapor Deposition (HDP-CVD)
These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.
Striker Product Family
Atomic Layer Deposition (ALD)
Using advanced ALD technology, these products deliver dielectric films with exceptional control for critical processes in advanced devices with nanoscale features.
VECTOR Product Family
Plasma-Enhanced Chemical Vapor Deposition (PECVD)
Our PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.
Related blog posts
Tech Brief: Elements of ElectroplatingAUGUST 13, 2018
Electroplating is a common manufacturing process that applies a thin layer of one metal onto another. The U.S. penny, for example, has been made of zinc with a thin, electroplated coating of copper since 1982. Jewelry and flatware are also frequently electroplated to improve visual appearance or provide wear and corrosion resistance. Today, electroplating is widely performed in the electronics industry to deposit conducting metals used in printed circuit boards, connectors, and most recently in semiconductor interconnects.
SPARC: a new deposition technology for advanced logic and DRAMJUNE 16, 2022
Chips are everywhere: from our mobile phones and automobiles to cloud servers for artificial intelligence, all of which seem to get faster, smarter, and better with each generation. Creating more powerful chips typically involves shrinking transistors and other components and packing them more closely together. As chip features become smaller, however, the incumbent materials may no longer achieve the same performance at the desired thickness and new materials may be needed.