Deposition - Lam Research
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Deposition Products

Creating flawless
thin films

Deposition processes create layers of dielectric (insulating) and metal (conducting) materials used to build a semiconductor device. Depending on the type of material and structure being made, different techniques are employed. Electrochemical deposition (ECD) creates the copper “wiring” (interconnect) that links devices in an integrated circuit. Metal plating of copper and other metals is also used for through-silicon vias and wafer-level packaging applications. Tiny tungsten connectors and thin barriers are made with the precision of chemical vapor deposition (CVD) and atomic layer deposition (ALD), which adds only a few layers of atoms at a time. Plasma-enhanced CVD (PECVD), high-density plasma CVD (HDP-CVD), and ALD are used to form the critical insulating layers that isolate and protect all of these electrical structures. Pulsed laser deposition (PLD) is used to enable high performance piezoelectric layers. PLD is a physical vapor deposition method that uses high pulsed energy laser light to energize material, creating a deposition vapor that can be condensed on different substrates. 

For the numerous materials and demanding features involved, Lam’s thin film deposition products provide the precision, performance, and flexibility needed for a wide range of challenging device applications.


Deposition

Our Products

ALTUS Product Family

Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD)

Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.

Pulsus Product Family

Pulsed Laser Deposition (PLD)

Our Pulsus product family provides thin film deposition solutions for a wide range of complex multi-compound materials for Specialty Technologies applications.

Reliant Deposition Products

Chemical Vapor Deposition (CVD) High-Density Plasma Chemical Vapor Deposition (HDP-CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Pulsed Laser Deposition (PLD) Reliant Systems

Our Reliant deposition products enable roadmaps for Specialty Technologies and extend the productive life of fabs.

SABRE 3D Product Family

Electrochemical Deposition (ECD)

Using our proven Electrofill technology, these high-productivity systems deliver quality metal films for advanced packaging applications.

SABRE Product Family

Electrochemical Deposition (ECD)

This product family offers precision metal plating for copper damascene manufacturing on the industry’s productivity-leading ECD platform.

SOLA Product Family

Ultraviolet Thermal Processing (UVTP)

This product family offers specialized post-deposition film treatments to improve physical characteristics for advanced film applications.

SPEED Product Family

High-Density Plasma Chemical Vapor Deposition (HDP-CVD)

These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.

Striker Product Family

Atomic Layer Deposition (ALD)

Using advanced ALD technology, these products deliver dielectric films with exceptional control for critical processes in advanced devices with nanoscale features.

Triton Product Family

Electrochemical Deposition (ECD) Wet Clean/Strip/Etch

The Triton platform is a versatile and modular solution for single wafer plating and wet processing.

VECTOR Product Family

Plasma-Enhanced Chemical Vapor Deposition (PECVD)

Our PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.

Related blog posts

  • Tech Brief: Elements of Electroplating

    AUGUST 13, 2018

    Electroplating is a common manufacturing process that applies a thin layer of one metal onto another. The U.S. penny, for example, has been made of zinc with a thin, electroplated coating of copper since 1982. Jewelry and flatware are also frequently electroplated to improve visual appearance or provide wear and corrosion resistance. Today, electroplating is widely performed in the electronics industry to deposit conducting metals used in printed circuit boards, connectors, and most recently in semiconductor interconnects.

  • SPARC: a new deposition technology for advanced logic and DRAM

    JUNE 16, 2022

    Chips are everywhere: from our mobile phones and automobiles to cloud servers for artificial intelligence, all of which seem to get faster, smarter, and better with each generation. Creating more powerful chips typically involves shrinking transistors and other components and packing them more closely together. As chip features become smaller, however, the incumbent materials may no longer achieve the same performance at the desired thickness and new materials may be needed.

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