DEPOSITION PRODUCTS

CREATING FLAWLESS
THIN FILMS

Deposition processes create layers of dielectric (insulating) and metal (conducting) materials used to build a semiconductor device. Depending on the type of material and structure being made, different techniques are employed. Electrochemical deposition (ECD) creates the copper “wiring” (interconnect) that links devices in an integrated circuit. Metal plating of copper and other metals is also used for through-silicon vias and wafer-level packaging applications. Tiny tungsten connectors and thin barriers are made with the precision of chemical vapor deposition (CVD) and atomic layer deposition (ALD), which adds only a few layers of atoms at a time. Plasma-enhanced CVD (PECVD), high-density plasma CVD (HDP-CVD), and ALD are used to form the critical insulating layers that isolate and protect all of these electrical structures.

For the numerous materials and demanding features involved, Lam’s thin film deposition products provide the precision, performance, and flexibility needed for a wide range of challenging device applications.



Deposition

Our Products

ALTUS Product Family

Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD)

Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.

Reliant Deposition Products

Chemical Vapor Deposition (CVD) High-Density Plasma Chemical Vapor Deposition (HDP-CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Reliant Systems

Lam’s refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for dielectric film applications.

SABRE 3D Product Family

Electrochemical Deposition (ECD)

Using Lam’s proven Electrofill technology, these high-productivity systems deliver quality metal films for advanced packaging applications.

SABRE Product Family

Electrochemical Deposition (ECD)

This product family offers precision metal plating for copper damascene manufacturing on the industry’s productivity-leading ECD platform.

SOLA Product Family

Ultraviolet Thermal Processing (UVTP)

This product family offers specialized post-deposition film treatments to improve physical characteristics for advanced film applications.

SPEED Product Family

High-Density Plasma Chemical Vapor Deposition (HDP-CVD)

These dielectric deposition products provide complete gapfill of high aspect ratio spaces with industry-leading throughput and reliability.

Striker Product Family

Atomic Layer Deposition (ALD)

Using advanced ALD technology, these products deliver dielectric films with exceptional control for critical processes in advanced devices with nanoscale features.

VECTOR Product Family

Plasma-Enhanced Chemical Vapor Deposition (PECVD)

Lam’s PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.


Related Blog Posts

circle-arrow2circle-arrow2facebookgooglehandshake2health2linkedinmenupdfplant2searchtwitteryoutube