The semiconductor industry continues to push the scaling limits of logic, memory, and image sensor chips in an effort to deliver higher processing speeds, more data storage, and faster pattern recognition. The advent of 3D architectures with new methods of feature shrinking, in turn, are driving the need for innovation in chip manufacturing. To enable these approaches, deposition processes must provide ultra-thin, conformal dielectric films with properties targeting critical solutions for advanced patterning, capacitance reduction, superior electrical isolation, and damage-free hermetic encapsulation. Equipment makers are turning to ALD technology – where films are grown layer-by-layer and are not affected by feature size and pattern density – to deliver the required on-wafer results. At the same time, providing the productivity needed for manufacturing environments is also a key requirement.