Solution: High Bandwidth Memory
SABRE Product Family
Electrochemical Deposition (ECD)
This product family offers precision metal plating for copper damascene manufacturing on the industry’s productivity-leading ECD platform.
Striker Product Family
Atomic Layer Deposition (ALD)
Using advanced ALD technology, these products deliver dielectric films with exceptional control for critical processes in advanced devices with nanoscale features.
Syndion Product Family
Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE)
For deep etch applications, this product family provides the exceptional across-wafer uniformity control needed for critical high aspect ratio features.
VECTOR Product Family
Plasma-Enhanced Chemical Vapor Deposition (PECVD)
Our PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.