Strip & Clean Products | Photoresist Strip. Wet Clean. Plasma Bevel Clean | Lam Research
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Strip & Clean Products

Leaving ultra-pristine surfaces

Strip and clean techniques are used between manufacturing steps to eliminate unwanted material that could later lead to defects and to prepare the wafer surface for subsequent processing. Photoresist strip removes the photoresist film and residues following ion implant or etch steps. To clear away particles, contaminants, residues, and other unwanted materials, wafer cleaning steps are inserted throughout manufacturing. Wet processing technologies can be used for wafer cleaning as well as strip and etch applications. Plasma bevel cleaning is used to enhance die yield by removing unwanted materials from the wafer’s edge that could impact the device area.

Lam’s strip technologies selectively remove remaining photoresist and provide process flexibility for multiple applications, while our high-productivity clean products deliver pristine surfaces center to edge for the most demanding cleaning steps.


Strip & Clean

OUR PRODUCTS

DV-Prime & Da Vinci Product Families

Wet Clean/Strip/Etch

These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.

EOS Product Family

Wet Clean/Etch

Our advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.

Reliant Clean Products

Reliant Systems Wet Clean/Strip/Etch

Our Reliant clean products enable roadmaps for Specialty Technologies and extend the productive life of fabs.

SP Series Product Family

Wet Clean/Strip/Etch

This proven product family delivers reliable, cost-efficient wet clean/wet etch solutions that gently remove unwanted materials from the wafer.

Triton Product Family

Electrochemical Deposition (ECD) Wet Clean/Strip/Etch

The Triton platform is a versatile and modular solution for single wafer plating and wet processing.

Related blog posts

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    SEPTEMBER 13, 2021

    Lam recently achieved an impressive product milestone with the shipment of our 10,000th single wafer clean chamber. This marks an incredible journey from the SP100 single chamber product first shipped in 1991 to the state-of-the-art EOS® 16-chamber tools shipped today to the most advanced fabs in the world.

  • Lam Introduces New Photoresist Strip Capability for 200 mm

    OCTOBER 12, 2020

    Lam’s newest product in its line of GAMMA® dry photoresist strip systems, brings the performance of the GAMMA® GxT® 300 mm to 200 mm wafer processing. The GAMMA GxT has been specifically designed for the specialty technologies market, bringing exceptional reliability, productivity, and flexibility to these applications.

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