Leaving ultra-pristine surfaces
Strip and clean techniques are used between manufacturing steps to eliminate unwanted material that could later lead to defects and to prepare the wafer surface for subsequent processing. Photoresist strip removes the photoresist film and residues following ion implant or etch steps. To clear away particles, contaminants, residues, and other unwanted materials, wafer cleaning steps are inserted throughout manufacturing. Wet processing technologies can be used for wafer cleaning as well as strip and etch applications. Plasma bevel cleaning is used to enhance die yield by removing unwanted materials from the wafer’s edge that could impact the device area.
Lam’s strip technologies selectively remove remaining photoresist and provide process flexibility for multiple applications, while our high-productivity clean products deliver pristine surfaces center to edge for the most demanding cleaning steps.
OUR PRODUCTS
Strip & Clean
DV-Prime & Da Vinci Product Families
These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.
EOS Product Family
Our advanced wet clean products deliver exceptionally low on-wafer defectivity at high throughput for progressively demanding applications.
Phoenix Product Family
Phoenix offers a fully-automated high volume panel processing for 510x515mm substrates.
Reliant Clean Products
Our Reliant clean products enable roadmaps for Specialty Technologies and extend the productive life of fabs.
SP Series Product Family
This proven product family delivers reliable, cost-efficient wet clean/wet etch solutions that gently remove unwanted materials from the wafer.
Triton Product Family
The Triton platform is a versatile and modular solution for single wafer plating and wet processing.
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