Leaving ultra-pristine surfaces
Strip and clean techniques are used between manufacturing steps to eliminate unwanted material that could later lead to defects and to prepare the wafer surface for subsequent processing. Photoresist strip removes the photoresist film and residues following ion implant or etch steps. To clear away particles, contaminants, residues, and other unwanted materials, wafer cleaning steps are inserted throughout manufacturing. Wet processing technologies can be used for wafer cleaning as well as strip and etch applications. Plasma bevel cleaning is used to enhance die yield by removing unwanted materials from the wafer’s edge that could impact the device area.
Lam’s strip technologies selectively remove remaining photoresist and provide process flexibility for multiple applications, while our high-productivity clean products deliver pristine surfaces center to edge for the most demanding cleaning steps.