SP Series Product Family

Products

SP Series Product Family

Wet Clean

Advanced Packaging, Analog & Mixed signal, Discrete & Power Devices, Optoelectronics & Photonics, Sensors & Transducers

For advanced wafer-level packaging (WLP), the wet clean steps used between processes that form the package and external wiring have surprisingly complex requirements. These processes are called on to completely remove specific materials and leave other fragile structures undisturbed.

With a broad range of process capability, Lam’s SP Series products deliver cost-efficient, production-proven wet clean/wet etch solutions for these challenging WLP applications. For some applications, select models are also available through our Reliant^® Systems as refurbished products, providing lower cost of ownership with the same quality assurance and performance as new systems.

Industry Challenges

Throughout the advanced wafer-level packaging (WLP) manufacturing sequence, wet processing steps are used for several key applications that vary widely in their process requirements. Wet clean processes must be capable of selectively and thoroughly removing residues from many surface types and feature shapes, including bonding pads, bumps, and high-aspect ratio (HAR) through-silicon vias (TSVs). Wet etch technologies are also used for WLP substrate thinning and wafer stress relief applications, which require fast-working, yet well-controlled processes. In addition, because of large feature sizes, high throughput and low-cost manufacturing are important.

Key Customer Benefits

High productivity and flexibility
Excellent process uniformity across the wafer, wafer-to-wafer, and lot-to-lot
Device-side protection provided by a Bernoulli chuck
Reduced running costs enabled by multiple recirculation of chemistries
Single-, dual-, and multi-chamber tools with ultra-thin substrate handling for 150 mm to 300 mm wafers

Product Offerings

SP203L
SP223
SP323

Key Applications

Silicon substrate thinning/stress relief
Underbump metallization etch
Photoresist removal
Post-deflux clean