Wafer cleaning is performed repeatedly during semiconductor device manufacturing and is a critical process that affects product yield and reliability. Unwanted microscopic materials – some no bigger than the tiny structures themselves – need to be cleaned effectively. At the same time, these processes must selectively remove residues that are chemically similar to the device films.
Based on Lam’s pioneering single-wafer spin technology, our DV-Prime® and Da Vinci® products provide the process flexibility needed with high productivity to address a wide range of wafer cleaning steps throughout the manufacturing process flow. For some applications, select models are also available through our Reliant® Systems as refurbished products, providing lower cost of ownership with the same quality assurance and performance as new systems.