Dielectric “gapfill” processes deposit critical insulation layers between conductive and/or active areas by filling openings of various aspect ratios between conducting lines and between devices. With advanced devices, the structures being filled can be very tall and narrow. As a result, high-quality dielectric films are especially important due to the ever increasing possibility of cross-talk and device failure.
Lam’s SPEED® HDP-CVD products provide a multiple dielectric film solution for high-quality gapfill with industry-leading throughput and reliability. For some applications, select models are also available through our Reliant® Systems as refurbished products, providing lower cost of ownership with the same quality assurance and performance as new systems.