SABRE 3D Product Family - Lam Research

SABRE 3D Product Family

SABRE 3D Product Family


Electrochemical Deposition (ECD)

Advanced Packaging

Copper and other metals are deposited to create the electrical connections that are used in advanced wafer-level packaging (WLP) and through-silicon via (TSV) structures. These tiny conducting parts help enable shrinking overall device dimensions to produce smaller, faster, and more powerful mobile electronics.

The SABRE® 3D family combines Lam’s proven SABRE Electrofill® technology with additional innovation to deliver the high-quality films needed for WLP and TSV applications at high productivity.

Industry Challenges

Electroplating of copper and other metals is used for a number of advanced WLP applications, such as forming conductive bumps and redistribution layers, and for filling TSVs. While similar to copper fill for back-end-of-line (BEOL) damascene, electroplating for WLP and TSV is at a much larger scale – on the order of microns (10-6 m) versus angstroms (10-10 m) of film to be deposited. This often requires long deposition times and multi-step processing. Challenges include improving within-wafer uniformity and within-die co-planarity at high plating rates, reducing cost of ownership, minimizing defects, and achieving reliable and void-free microbumps and solder joints.

Key Customer Benefits

  • Faster plating rates without compromising within-die and within-wafer uniformities enabled by advanced plating cell technology
  • Hardware and process knobs to improve die yield and system output
  • Flexibility to address a variety of packaging applications with modular architecture that can be configured with multiple plating and pre/post-treatment cells
  • Low cost of ownership for cost-sensitive environments, including technology to significantly lower SnAg chemistry costs

Product Offerings

  • SABRE® 3D
  • SABRE® 3D xT

Key Applications

  • TSV
  • Copper pillar
  • Redistribution layers (RDL)
  • Underbump metallization (UBM)
  • Leaded or lead-free C4 bumping
  • Cu/SnAg and Ni/Au microbumps
  • High-density fan-out (HDFO) applications (megapillar, RDL, 2-in-1 via, micropillars)