製造無缺陷的
薄膜
沉積製程可形成用於製造半導體元件的介電層(絕緣)和金屬(導電)材料層。 根據製作材料和結構的類型,會採用不同的技術。 電化學沉積(ECD)可生成連接積體電路中元件的銅「佈線」(互連)。 銅和其他金屬的金屬電鍍也用於矽穿孔和晶圓級封裝應用。 利用化學氣相沉積(CVD)和原子層沉積(ALD)技術,每次只需新增幾層原子,就能精確地製造出微小的鎢連接器和薄阻障層。 電漿輔助化學氣相沉積(PECVD)、高密度電漿化學氣相沉積(HDP-CVD)和原子層沉積(ALD)是用來形成隔離和保護所有這些電氣結構的關鍵絕緣層。使用脈衝雷射沉積(PLD)技術可實現高效能壓電層。PLD 是一種物理氣相沉積方法,它使用高脈衝能量雷射照射材料,產生沉積蒸氣,並將其凝結在不同的基板上。
對於所涉及的眾多材料和高要求特性,科林研發的薄膜沉積產品可為各種具有挑戰性的元件應用提供所需的精度、效能和廣泛應用性。
沉積
我們的產品ALTUS系列產品
Atomic Layer Deposition (ALD) 化學氣相沉積(CVD)
結合化學氣相沉積(CVD)和原子層沉積(ALD)技術,這些領先市場的系統可為先進的鎢金屬化應用沉積出所需之高度均勻一致的(conformal)薄膜。
SABRE 3D 系列產品
Electrochemical Deposition (ECD)
利用Lam Research通過驗證的Electrofill 技術,這些高生產力系統可為先進封裝應用提供所需的高品質金屬薄膜。
STRIKER系列產品
Atomic Layer Deposition (ALD)
利用先進的ALD技術,這些產品可為介電層薄膜提供優異的控制能力,以建構關鍵製程中具備奈米級結構的先進元件。
相關部落格文章
-
Tech Brief: Elements of Electroplating
AUGUST 13, 2018Electroplating is a common manufacturing process that applies a thin layer of one metal onto another. The U.S. penny, for example, has been made of zinc with a thin, electroplated coating of copper since 1982. Jewelry and flatware are also frequently electroplated to improve visual appearance or provide wear and corrosion resistance. Today, electroplating is widely performed in the electronics industry to deposit conducting metals used in printed circuit boards, connectors, and most recently in semiconductor interconnects.
-
SPARC: a new deposition technology for advanced logic and DRAM
JUNE 16, 2022Chips are everywhere: from our mobile phones and automobiles to cloud servers for artificial intelligence, all of which seem to get faster, smarter, and better with each generation. Creating more powerful chips typically involves shrinking transistors and other components and packing them more closely together. As chip features become smaller, however, the incumbent materials may no longer achieve the same performance at the desired thickness and new materials may be needed.