Dielectric etch carves patterns in insulating materials to create barriers between the electrically conductive parts of a semiconductor device. For advanced devices, these structures can be extremely tall and thin and involve complex, sensitive materials. Slight deviations from the target feature profile – even at the atomic level – can negatively affect electrical properties of the device.
To precisely create these challenging structures, Lam’s Flex® product family offers differentiated technologies and application-focused capabilities for critical dielectric etch applications. For some applications, select models are also available through our Reliant™ Systems as refurbished products, providing lower cost of ownership with the same quality assurance and performance as new systems.