互連構成了複雜的佈線，用來連接晶片上數十億個獨立單元，包括電晶體、電容等。隨著越來越小的元件緊密地放置在一起，因此也需要更多的互連層，這使連結晶片上的所有單元也越來越具挑戰性。事實上，隨著特徵結構尺寸的持續微縮，互連結構已成為現今最先進晶片的速度瓶頸。因此，需要開發能把金屬連接的電阻降至最低的技術以及創新的介電材料，以提升其絕緣能力。為了生產最先進的高效能電子元件，先進的互連結構涉及狹窄的幾何與複雜的薄膜層，需要更靈活、更精密的製程功能來實現。
互連
解決方案
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