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Technical Glossary
…ICP see inductively coupled plasma ILD see interlayer dielectric IMD see intermetal dielectric INDUCTIVELY COUPLED PLASMA (ICP) a type of plasma source in which plasma is formed when radio frequency…
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Event Calendar
…Head 2024 IITC PESM 2024 3D & SYSTEMS SUMMIT Sensors Converge ISES EU Power LETI Innovation Days 2024 SEMICON West SEMICON Taiwan LE2AP+LEELIS 2024 ISES China MEMS and Sensors Exec…
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Hotel Accomodations
…by Marriott Residence Inn – Lake Oswego The Grand Hotel at Bridgeport Century Hotel Hilton Garden Inn Near Taiwan Training Center Lam Research Preferred Hotels Ambassador Hotel Lakeshore Hotel Royal…
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SABRE 3D Product Family
Copper and other metals are deposited to create the electrical connections that are used in advanced wafer-level packaging (WLP) and through-silicon via (TSV) structures. These tiny conducting parts help enable…
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NQA Page 2
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ESG Strategy
ESG Strategy ESG goals We aspire to integrate ESG into everything we do Contributing to the United Nations Sustainable Development Goals (UN SDGs)…
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Our Solutions
…and complex film layers, which require increasingly flexible and precise process capabilities. Patterning Patterning involves the set of process steps – including lithography, deposition, and etch – that create the…
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Advanced Memory Solutions
…the mainstay for “working” (active) memory, while flash memory is used to store large amounts of data in a compact form. To increase device density for more storage capacity, DRAM…
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SEMICON West 2023
… Panel: Accelerating Cybersecurity Initiatives Jason Callahan, panelist 4:05 – 4:45 pm Moscone North, Room 21 Thursday, July 13 TechTalk: Accelerating the Pace of Lithography and Scaling Innovation EUVL Dry…
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test wp admin tab sbb 10
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