SEMICON West 2026

Keynote: High-Volume Manufacturing Yield Improvement Adoption of AI-coupled, Physics-Based Digital Twins
Joseph Ervin, Managing Director, Semiverse® Solutions
10:35 AM – 10:55 AM
Moscone Center, North Hall, Expo Floor, Smart Manufacturing Pavilion

Panel – IEEE Panel-The True Value and Cost of Agentic AI in SoC Design and Manufacturing
David M. Fried, Chief AI Officer and Corporate Vice President
12:15 PM – 1:00 PM
Moscone Center, North Hall, Lower Level, Room 20

From the Molecules to the Megafab: GHG Emission Reduction Opportunities
Wojtek Osowiecki, Senior Product Marketing Engineer
1:03 PM – 1:20 PM
Moscone Center, South Hall, Lower Level, Room 1, Sustainability Pavilion

From Process to Chips: How Can AI Increase Velocity in Chip Manufacturing
David M. Fried, Chief AI Officer and Corporate Vice President
1:05 PM – 1:27 PM
Moscone Center, North Hall, Lower Level, Room 20

Breaking the Integration Wall: Advanced Packaging for the AI Era 
Anand Murthy, Vice President, Advanced Technology Integration
10:55 AM – 11:15 AM
Moscone Center, South Hall, Upper Mezzanine, Room 156

AI Physics for Real-Time Process Digital Twins
Joseph Ervin, Managing Director, Semiverse® Solutions
2:30 PM – 2:55 PM
Moscone Center, North Hall, Expo Floor, Smart Manufacturing Pavilion

Panel – Global Partnerships: Climate Fresk & CESI Regional Perspectives (panel)
Wojtek Osowiecki, Senior Product Marketing Manager
10:35 AM – 10:50 AM
Moscone Center, South Hall, Lower Level, Room 1, Sustainability Pavilion

Enabling Silicon Photonics with Advanced Fabrication Solutions
David Haynes, VP, Specialty Technologies
11:20 AM – 11:35 AM
Moscone Center, South Hall, Upper Mezzanine, Room 154