Products
Phoenix Product Family
Electrochemical Deposition (ECD)PR-DevelopmentPR-StripWet Clean/Strip
-
about
-
products
-
customer support
-
careers
-
investors
-
newsroom
-
Languages
- MyLam
Phoenix Product Family
Phoenix offers a fully-automated high volume panel processing for 510x515mm substrates.
Designed with the goal to redefine cost of ownership, Phoenix delivers unique technologies in the panel level packaging industry together with a respectful usage of its operating utilities.
Inspired by wafer level performance Phoenix offers strip, development, etch and plating solutions to address the future market requirements driven by AI, high performance computing and other applications.
Industry Challenges
Advanced packaging is becoming an increasingly critical approach to continue scaling beyond silicon. Several device manufacturers and fabless companies are increasing adoption of novel chiplet solutions to meet level performance and cost requirements. This accelerating chiplet transition requires new packaging solutions and innovations in the substrate market segment. As traditional silicon scaling approaches cost and technology limitations, companies are adopting novel chiplet and heterogenous integration solutions. To ensure continued scaling, substrate solutions require several innovations in process equipment solutions. In addition to meeting the technology roadmap needs, substrate level equipment must have increased flexibility to process panels of various materials and sizes. In addition, high productivity and low cost of ownership are desirable for high volume manufacturing environments.
Key Customer Benefits
- Fully automated system for large volume
- Processing of 510x515mm panels
- Thin glass handling capability
- Simultaneous double sided treatment of panels
- Full exposed panel surface treatment due to vacuum chuck technology
- Plating and etch uniformity performance
- Ready for online dosing and chemical monitoring system (internal/external)
- Flexible Tool layouts tailored to fab environment - optimized for low cost of ownership
Product Offerings
- Phoenix VRT (Vertical Resist Treatment)
- Phoenix ECD (Electrochemical Deposition)
- Phoenix VCA (Vertical Clean Application)
Key Applications
- Electrochemical deposition of Cu, Ni, SnAg, Au, others on bumps, pillars, pads, RDL, TGV, FLI
- Metal etch, UBM etch, oxide etch
- PR-strip, PR-development