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Our Reliant deposition products enable roadmaps for Specialty Technologies and extend the productive life of fabs.
New developments in semiconductor packaging are contributing to the quest to extend Moore’s Law, the predictive model of adding more transistors to a semiconductor. One promising development is advanced packaging, which can better manage the power consumption of a collection of chips while shrinking their total size.
The accelerating costs of transistor scaling are pushing the industry to find innovative ways to improve chip and system performance from generation to generation. That’s why heterogenous integration (HI) has become the latest inflection in packaging technology.