Pulsus Product Family - Lam Research

Pulsus Product Family

Pulsus Product Family


Pulsed Laser Deposition (PLD)

RF MEMS, Sensors & Transducers

Pulsed laser deposition (PLD) is a very versatile thin film deposition technology that has the ability to deposit a wide range of complex multi-compound materials.  With today’s market demand for enhanced and new material systems, PLD enables layers that cannot be deposited by conventional technologies like reactive sputtering or ALD.

Lam’s Pulsus PLD products enable mass production of > 30% ScAlN films for Specialty Technologies applications.  This deposition solution enables more advanced device design and is driving the next generation of RF filters for 5G and WiFi 6, high-end MEMS microphones and other MEMS applications.  New technologies, based on oxide and nitride films, are in continuous development to meet market demand.

Industry Challenges

The diverse range of applications in Specialty Technologies requires the processing of novel materials. One such material is scandium-doped aluminum nitride (ScAlN) which is of great interest in high frequency MEMS applications because of its very high electro-mechanical coupling. With the growth of the 5G market, the need for higher frequency band-filters is creating challenges for existing high-volume production technologies. The MEMS and 5G industry require high piezo performance (e31,f) with low internal losses (tan δ). To address these challenging requirements, a very versatile thin film deposition technology is required to enable more advanced device design.

Key Customer Benefits

  • Versatility to deposit complex materials, especially ceramics such as AlScN
  • Superior film quality, including high piezoelectric performance with low dielectric losses
  • Advanced film control, such as WiW uniformity tuning of film thickness and stress
  • High throughput and low cost of ownership, supported by the platform design and unique PLD target technology

Product Offerings

  • Pulsus

Key Applications

  • ScAlN layers for RF MEMS, MEMS microphones, piezoelectric micromachined ultrasonic transducers (PMUT’s), microspeakers