電晶體─亦即晶片的「大腦」─ 是控制電流流向的極小開關，在一顆晶片中可包含高達數十億個電晶體。隨著市場對更小，更強大電子產品的需求，推動了3D FinFET 等新型電晶體架構的發展，並使用高介電值(high-k)/金屬閘等特殊材料。這些新技術和新材料的發展使元件的特徵結構尺寸得以持續微縮。由於現今最新的電晶體尺寸已達到原子級，對製造而言是極大的挑戰。為確保這些先進元件的優異效能，製造功能需提供卓越的精密度與控制，才能形成所需的微小結構。
電晶體
解決方案
ALTUS系列產品
Atomic Layer Deposition (ALD) 化學氣相沉積（CVD）
結合化學氣相沉積(CVD)和原子層沉積(ALD)技術，這些領先市場的系統可為先進的鎢金屬化應用沉積出所需之高度均勻一致的(conformal)薄膜。
CORONUS系列產品
Plasma Bevel Etch and Deposition
Coronus 系統專注於晶圓邊緣，以提高產品良率。半導體製程會導致殘留物和微粗糙沿著晶圓邊緣積聚，它們可能會剝落、漂移到其他區域並產生導致元件失效的缺陷。Coronus 刻蝕產品可去除邊緣殘留物，Coronus 沉積可保護晶圓邊緣不受損害。
STRIKER系列產品
Atomic Layer Deposition (ALD)
利用先進的ALD技術，這些產品可為介電層薄膜提供優異的控制能力，以建構關鍵製程中具備奈米級結構的先進元件。
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