互连由复杂的布线构成,连接着芯片上数十亿个组件(晶体管、电容等)。随着器件不断变小、封装密度不断加大,需要更多的互连层次,而要把一切都连接起来,挑战性必然越来越大。事实上,随着构件尺寸继续缩小,互连已成为当今最先进的芯片的速度瓶颈。因此,我们需要能尽量降低金属互连电阻的技术以及能提升隔离能力的新型介电材料。为了生产最新的高性能电子器件,先进互连结构具有尺寸狭小、薄膜层复杂的特点,这需要越来越灵活和精密的加工能力。
互连
我们的解决方案Coventor Product Family
Plasma Modeling Semiconductor Process Modeling
Our semiconductor process modeling software (SEMulator3D) and plasma modeling software (OverViz) perform predictive modeling of etch, deposition, plasma & other processes, to identify problems prior to fabrication.
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Perspectives on Advanced Interconnect Developments
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