Technology: Electrochemical Deposition (ECD)

Kallisto Product Family

Electrochemical Deposition (ECD)

An advanced vertical processing platform for wet chemical treatment of substrates from 300x300mm up to Gen 5.1 (1100 x 1300mm) tailored to the needs of semi industry.

Advanced Memory, Advanced Packaging, Advanced Substrates, Analog & Mixed Signal, Automotive, Discrete & Power Devices, Mini/Micro LED, Optoelectronics & Photonics, Panel Level Fanout

Phoenix Product Family

Electrochemical Deposition (ECD) PR-Development PR-Strip Wet Clean/Strip

Phoenix offers a fully-automated high volume panel processing for 510x515mm substrates.

Advanced Memory, Advanced Packaging, Advanced Substrates, Analog & Mixed Signal, Automotive, Discrete & Power Devices, Mini/Micro LED, Optoelectronics & Photonics, Panel Level Fanout

SABRE 3D Product Family

Electrochemical Deposition (ECD)

Using our proven Electrofill technology, these high-productivity systems deliver quality metal films for advanced packaging applications.

Advanced Packaging

SABRE Product Family

Electrochemical Deposition (ECD)

This product family offers precision metal plating for copper damascene manufacturing on the industry’s productivity-leading ECD platform.

Advanced Memory, High Bandwidth Memory, Interconnect

Triton Product Family

Electrochemical Deposition (ECD) Wet Clean/Strip

The Triton platform is a versatile and modular solution for single wafer plating and wet processing.

Advanced Memory, Advanced Packaging, Analog & Mixed Signal, Automotive, Discrete & Power Devices, Mini/Micro LED, Optoelectronics & Photonics